TA Instruments Japan Company Profile

Date and Time: August 29, 2024 (Thursday) For details and registration, please use the link below! https://pages.waters.com/2024-08-29-WBN-TAJPPolymerEvaluationSeminarRheology_LP-Registration1.html 1:00 PM - 3:00 PM [Title] Fundamentals of Viscoelastic Measurement Using Rotational Rheometers and Applications to Polymer Materials [Overview] Rheology is the scientific field concerning the deformation and flow of materials, utilized across a wide range of markets including petrochemicals, food, and pharmaceuticals. In polymers, rheological measurement techniques significantly cover the manufacturing value chain from synthesis to formulation, process characteristics, and the performance of final products. This presentation will focus on the fundamentals of rotational rheometers, followed by examples of polymer rheology analysis centered on thermoplastic and thermosetting resins, as well as elastomers. [Speaker] Masayoshi Takano, Application Department, TA Instruments

Event Date and Time: July 9, 2024 (Tuesday) For details and registration, please use the link below! https://pages.waters.com/2024-07-09-WBN-TAJPRheo-ISWebinarwithHIOKI_LP-Registration1.html 13:00–13:10 Introduction 13:10–13:55 [Title] Evaluation of Electronic Conductivity of Slurries – Introduction to Impedance Analysis Principles and Case Studies [Speaker] Naoto Nakayama, HIOKI E.E. Corporation 13:55–14:40 [Title] Evaluation of LIB Electrode Slurries Under Flow Using Rheo-Impedance Measurement [Speaker] Yuki Kawata, Application Department, TA Instruments

Event Date and Time: July 4, 2024 (Thursday) For details and registration, please use the link below! https://pages.waters.com/2024-07-04-WBN-TAJP-AutoTrimShortWebinar_LP-Registration1.html 1:00 PM - 1:40 PM [Title] Measurement Methods and Evaluation Cases of Thermal and Light-Curable Resins Using a Rotational Rheometer [Overview] Rotational rheometers possess excellent capabilities to evaluate an extremely wide range of viscosity and elasticity, spanning several orders of magnitude from low-viscosity liquids to high-elasticity solids. In the rapidly growing electronics industry, thermal and light-curable resins are widely used for encapsulation and adhesion in semiconductors and electronic devices. This presentation will introduce the lineup of equipment and accessories designed to meet the advanced technical requirements for these materials, along with measurement examples. [Speaker] Masayoshi Takano, Application Department, TA Instruments