レイリサーチ Product Lineup

Wafers are automatically transported from the wafer receiving stage to the measurement unit. After measurement is completed, the wafers can be stored in the designated unload cassette. We can accommodate the measurement and inspection equipment requested by the customer. [Features] - Capable of mounting the desired measurement and inspection equipment - Supports 8-inch and 12-inch wafers - Measurement conditions and results can be transmitted to higher-level systems

• Other semiconductor manufacturing equipment

This is a wafer thickness measurement device equipped with transfer and thickness measurement functions. It is capable of measuring the thickness at each point within the specified wafer. It supports 6-inch and 8-inch wafers. 【Features】 ■ Equipped with transfer and thickness measurement functions ■ Supports 6-inch and 8-inch wafers ■ Capable of measuring up to 2000 points (Thickness measurement points can be set arbitrarily) ■ Equipped with real-time monitoring function for acquired data

• Other semiconductor manufacturing equipment

This is a device for cleaning the wafer surface after dicing using two fluids: pure water and air. It controls the re-adhesion of suspended dust with a uniquely developed cleaning cup. It can accommodate various arrangements according to your usage needs. 【Features】 ■ Successful miniaturization of the device by compacting the transport section ■ Thorough cleaning of the wafer using two fluids: pure water and air ■ Contributes to yield improvement

• Other semiconductor manufacturing equipment

This is a device for inspecting cracks in solar cell modules, checking for electrode short circuits, and detecting defects on the cell light-receiving surface. It can also support heating tests due to wiring short circuits as an option. It is compatible with both inline and offline methods.

• Defect Inspection Equipment

This is a device that performs four inspection processes: "IR inspection," "front/back surface inspection," "thickness inspection (simple Bow/Warp)," and "resistance value measurement" for solar cell wafers. It can inspect wafers at a high speed of one wafer per second.

• Defect Inspection Equipment

This transport device separates and conveys wafers one by one. It can also transport stacked wafers (wafers in a stacked state).

• Other conveying machines

This is a front-opening type hoop opener that automatically opens and closes hoop doors. It is equipped only with the necessary functions, making it efficient and offered at a low price. It is also possible to customize it with the required functions for customers. Please feel free to contact us regarding any customization specifications. ■Features - The compact size allows for easy installation. - The cassette door opening and closing operation is completed in under 10 seconds. - The door opening and closing operation is performed with simple operation by just installing the cassette and pressing the OPEN/CLOSE button.

• Other semiconductor manufacturing equipment

Wafer transfer machine compatible with thin wafers (150μm). ■Features 1. Capable of handling a wide range from standard thickness to thin wafers. 2. Can be offered at a low price. 3. High throughput. 4. Compatible wafers are 5, 6, and 8-inch wafers. 5. A rich variety of equipment options (supports 2 to 4 carriers). 6. Provides transport modes tailored to user needs, such as lot splitting and integration. 7. Supports ID reading (Semi font/2D codes, etc.). 8. Upper-level communication with production management systems.

• Other semiconductor manufacturing equipment

We have achieved a smaller and space-saving design compared to conventional wafer transfer machines. By equipping only the necessary functions and eliminating waste, we can offer it at a low price. A user port is provided, allowing for docking with inspection units and other devices. We can accommodate various usage methods tailored to customer needs, such as for inspection machines or transport machines. It is also possible to customize the machine with requested functions from customers. ■Features - The compact size allows for easy installation. - Docking with inspection units is possible. - It can handle wafers ranging from 100mm to 200mm with or without notches. - We provide transport modes tailored to user needs, such as lot splitting and integration.

• Other semiconductor manufacturing equipment