We thoroughly clean the wafer with a two-fluid system.
This is a device for cleaning the wafer surface after dicing using two fluids: pure water and air. It controls the re-adhesion of suspended dust with a uniquely developed cleaning cup. It can accommodate various arrangements according to your usage needs. 【Features】 ■ Successful miniaturization of the device by compacting the transport section ■ Thorough cleaning of the wafer using two fluids: pure water and air ■ Contributes to yield improvement
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basic information
【Reference Specifications】 ■Ring Frame Size: 200mm, 300mm ■Components →Loader/Unloader Unit →Conveying Unit →Cleaning Unit
Price range
P7
Delivery Time
Applications/Examples of results
We can accommodate special specifications. Please feel free to contact us.
Company information
We focus on total system development, including the development and sales of semiconductor inspection equipment and software development. We take pride in our ability to provide development technical expertise, which allows us to propose development products at low prices without charging development fees. When we receive a development project, we first create an evaluation machine and proceed with development using our unique development process. By incorporating customer requests from the early stages of development and prioritizing collaboration with customers, we can offer customized products tailored to the specific requirements of our clients.