クラスターテクノロジー Product Lineup

"Epohard" is a resin composite material formulated with inorganic fillers, reinforcing agents, and coloring agents based on epoxy resin, developed as an insulating material to miniaturize and lighten ceramic insulators. It offers high freedom of molding and ensures dimensional accuracy, making insert molding of metal screws, flanges, copper rods, and more easy. It also achieves miniaturization and weight reduction that is impossible with porcelain, while exhibiting excellent mechanical properties. Additionally, due to its high productivity, it can also be used for compression and transfer molding. 【Features】 ○ Reliable track record from a top manufacturer ○ High freedom of molding and dimensional accuracy ○ Achieves miniaturization and weight reduction ○ Material with excellent productivity ○ High dielectric strength and tracking resistance For more details, please contact us or download the catalog.

The "Epoclustar J106S/J116S" is an epoxy resin-based composite material (plastic) developed by our company using a unique kneading technology. It can mass-produce high-precision parts without the need for post-processing, and is currently widely adopted in mechanical components for imaging equipment and industrial machinery. 【Features】 ■ Achieve precision parts like those made by cutting processing through injection molding! With a molding shrinkage rate of 0.03% (J106S) and a linear expansion coefficient of 9ppm (J106S), we have realized precision molding at the micron level. ■ Wide design flexibility leveraging the properties of the resin! Utilizing the characteristics of thermosetting resin, complex designs such as thin walls without material loss and varying wall thicknesses are possible. ■ Many applications in fields requiring chemical resistance! It is used in various fields where chemical resistance is required, such as in the liquid-contact parts of inkjet printers. ■ Customize resin materials according to required properties! In addition to high precision, various functional enhancements such as thermal conductivity and low water absorption are possible. For more details, please refer to the catalog, and feel free to contact us. *This product is provided as molded products processed by our company. Please note that we do not sell the material alone.

"Epocluseter J101" is a conductive epoxy resin composite material (plastic) developed by our company using a unique kneading technology based on epoxy resin. We can provide customized proposals according to the required characteristics. [Features] ■ High sliding properties and wear resistance By incorporating carbon fiber, we have achieved a low friction coefficient and high wear resistance. ■ Excellent isotropic dimensional accuracy With minimal molding shrinkage and reduced anisotropy, we can produce precision parts under stable conditions. ■ Wide design flexibility utilizing the properties of the resin Taking advantage of the characteristics of thermosetting resin, complex designs such as thin walls without material loss and variable thickness are possible. ■ Customization of resin materials according to required characteristics Not only high precision but also various functional enhancements such as thermal conductivity and low water absorption are possible. For more details, please refer to the catalog, and feel free to contact us. *This product will be provided as molded products processed by our company. Please note that we do not sell the material alone.

"Epoclustar Coolie" is a solid sealing material developed for transfer molding based on epoxy resin. It is a custom material unique to our company, designed for semiconductor, motor, and coil sealing applications. 【Achievements】 - High thermal conductivity grades (1–6 W/m·K) - Metal adhesion properties (Ni, Al, Au, Cu, Ag, etc.) - Grades suitable for thin-walled molding *The catalog includes representative grades. We can also propose materials outside of the catalog depending on your application, so please feel free to contact us.

The "Epoclustar J106S" leverages the characteristics of thermosetting resin, enabling complex designs that cannot be achieved with thermoplastic resins. With a molding shrinkage rate of 0.03% and a linear expansion coefficient of 9 ppm, it achieves precision molding at the micron level. It contributes to the resinization of metal and ceramic parts. 【Features】 ■ Low linear expansion coefficient ■ High precision molding ■ High production capacity Additionally, we will be exhibiting at "N-Plus 2025," which will be held at Tokyo Big Sight from October 15 (Wednesday) to October 17 (Friday). Booth number: R-42 We sincerely look forward to your visit. *Examples of actual applications where Epoclustar has been adopted, as well as key points, are also explained in downloadable materials. *For more details, please download the PDF or feel free to contact us.