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Advantech has launched the next-generation edge automation PC "UNO-2372V3," ideal for industrial automation and smart factories. It supports the latest Intel N250 processor and DDR5 memory, significantly improving processing performance compared to previous models. With a fanless and cableless design, it balances environmental resistance and maintenance, ensuring stable operation even in harsh environments ranging from -20 to 60°C. 【Key Features】 - High-performance processing with Intel N250 - Supports DDR5 memory (up to 16GB) - High-speed communication with 2.5GbE LAN x2 - 4K display support with USB Type-C + HDMI + DP - Flexible expansion with three types of M.2 slots - Enhanced reliability with a fanless structure This is an optimal solution for data collection, equipment monitoring, and integration from edge to cloud in smart factories.

Advantech has announced a business partnership with Edge Impulse, a subsidiary of Qualcomm. By pre-integrating Edge Impulse's AI development tools with Advantech's edge computing products (such as AI industrial motherboards, inference systems, AI servers, industrial AI cameras, and development kits), the barriers to AI development will be significantly reduced, allowing companies to quickly build and deploy AI projects. By combining the technologies of both companies, the workflow from AI model training to optimization, deployment, and monitoring can be streamlined, enabling reductions in development time and resources. Advantech will accelerate the utilization of edge AI across various fields such as manufacturing, healthcare, logistics, and smart cities by merging industry-leading software and hardware. For more details, please check the PDF.

Advantech Co., Ltd. will hold the "Advantech Embedded Design in Forum 2025 (ADF OSAKA)" on September 19, 2025 (Friday) in Umeda, Osaka. This event will showcase a selection of products and technologies specifically focused on edge AI and the embedded market, drawn from our company-hosted event "Edge.AI Day Japan 2025," which took place in July in Tokyo. On the day of the event, in addition to presentations on the latest technologies from leading silicon vendors such as Intel, AMD, NVIDIA, NXP, Qualcomm, and HAILO (in alphabetical order), we also plan to introduce AI application development case studies from partner companies. Furthermore, as a first for the Osaka venue, we will hold a workshop on AI applications. We invite you to participate in this event, which will provide cutting-edge information and practical insights aimed at accelerating business utilizing "edge AI." We sincerely look forward to your attendance.