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In semiconductor manufacturing equipment, there is often a demand for end effectors (the hand part of a transport robot) to be made from lighter, stronger, and less deflective materials. Processes that want to handle many wafers at once require wafers to be loaded into small clearance slits, leading to the use of thinner ceramic end effectors. Transport hands (end effectors) equipped with suction mechanisms need to have internal flow paths, but using adhesive for SUS bonding increases the risk of foreign material contamination. Our ceramic suction transport hands, made with our hollow integrated technology that eliminates the risk of metal contamination and particle ingress, have become the industry standard. PeriZac has further reduced particles by innovating the contact area and position of the wafer, gently holding the non-circuit outer peripheral part. They have received positive feedback from semiconductor device manufacturers aiming to improve yield.

• Other semiconductor manufacturing equipment

At Asuzak Corporation's Fine Ceramics Division, we have started working with porous ceramics, offering two types of materials: porous alumina and porous SiC. Currently, we have several types in our lineup, catering to your needs based on different applications. We propose porous ceramics that allow for free control of pore diameter and porosity thanks to our unique molding technology. Porous ceramics are used as adsorption tools for thin wafers and thin films. They allow gas to pass through but not plasma, making them suitable as fixtures for plasma devices. Being porous ceramics, they possess insulation and heat resistance. Depending on the size, we can achieve a flatness of about 5μm, enabling high precision in equipment. How about this usage? In addition to general porous alumina ceramics, we also handle porous ceramics made of SiC, so please consider using porous SiC in environments where alumina cannot be used (such as rapid cooling, rapid heating, and the use of hydrofluoric acid-based chemicals). How about using it in the manufacturing of optical lenses where rapid cooling and heating are required?

• Fine Ceramics

Due to its high hardness, it also possesses strong resistance to sliding wear. Its thermal conductivity is also high. Silicon carbide (SiC) is used in internal components of semiconductor manufacturing equipment and LED manufacturing equipment, as well as in substrate trays for etching devices and firing jigs (such as for capacitors). Silicon carbide (SiC) takes advantage of its heat resistance (even above 1,000 degrees), chemical resistance (plasma resistance), good wear resistance, thermal conductivity, density, and strength. How about this usage → Since thin products can be made with SiC, please consider using it as trays or setters for better thermal efficiency. It is possible to use thin SiC plates for firing furnace setters for electronic substrates.

• Fine Ceramics

At Asuzac, we offer a variety of high-purity, high-performance grades of alumina ceramics. We also sell alumina plates online. (http://www.asuzac-ceramics.jp/shop/shopenter.htm) Alumina is used in internal components of chambers in semiconductor manufacturing equipment and liquid crystal manufacturing equipment, as well as in transport arms. Due to its high electrical insulation properties (1015Ωcm), alumina serves as an insulating component within the chamber. The transport arms can be made thinner because alumina has higher bending strength compared to metals and resins, making warping less likely. How about using it this way? → We can provide large alumina products (including those over 3 meters) and hollow ceramics (tunnel shapes without adhesives), making it suitable for large ceramics in semiconductor Φ450 wafer manufacturing equipment and liquid crystal G10 glass substrate manufacturing equipment.

• Printed Circuit Board
• Ceramics