西進商事 Product Lineup

We would like to introduce the laser processing machine for thin-film solar cells, the "Laser Patterning Device," handled by Seishin Shoji. The compatible substrate size is 1100mm × 1400mm with a thickness of 3 to 5mm, and the processing line width is approximately 60μm. By using our unique optical system (multi-beam processing), we can perform the patterning process for thin-film solar cells at high speed. 【Features】 ■ Utilizes our unique optical system (multi-beam processing) ■ High-speed patterning processing for thin-film solar cells ■ Compatible substrate size: 1100mm × 1400mm t=3 to 5mm ■ Table speed: 1000mm/sec MAX ■ Processing line width: approximately 60μm *For more details, please refer to the related link page or feel free to contact us.

We would like to introduce the "Crystalline Solar Cell Manufacturing Equipment" handled by Seishin Shoji. Our lineup includes various devices, starting with the high-precision "Fully Automatic Screen Printing and Drying System" and the "Near Infrared (IR) Firing Furnace" that enables short-time firing. For over 20 years, we have been leveraging our development experience in solar cell manufacturing equipment to continuously provide manufacturing equipment for a wide range of applications in crystalline solar cells and thin-film solar cells. 【Product Lineup】 ■ Fully Automatic Screen Printing and Drying System ■ Near Infrared (IR) Firing Furnace ■ Near Infrared (IR) Drying Furnace ■ Wafer/Cell Transfer Device ■ Wafer/Cell Packaging Device ■ Laser Cell Scriber "Model: ST-2002" *For more details, please refer to the related link page or feel free to contact us.

This document provides detailed information on lasers commonly used in manufacturing, covering the basics of lasers that you may hesitate to ask about, such as "the principle of lasers," "the characteristics of lasers," and "the types of lasers." It also categorizes the types of lasers by their processing applications, making it useful for selecting the appropriate laser. Please take a moment to read it. 【Contents】 ■ What is a laser? ■ The principle of lasers ■ Characteristics of lasers ■ What exactly is a laser? ■ What can be done with lasers? ■ Types of lasers *For more details, please refer to the PDF document or feel free to contact us.

Are you having trouble removing rust and dirt from machine parts? With the JPT Laser Cleaner CL100, you can do it efficiently. Here are three highlights of this product! ◾️ Lightweight design suitable for long-term use. The head weighs only 620g. ◾️ Easy settings with a wireless remote control. ◾️ Affordable price range for easy introduction. Laser Cleaning For those considering laser cleaning!

The "LASER BLENDER" is a laser ablation device that achieves high-speed and high-precision LA-ICP analysis. It enables direct approaches to solid samples, allowing for "local," "imaging," and "depth" analysis. It not only simplifies the preprocessing for ICP analysis but also expands the range of analytical methods, including direct solid analysis, high-speed analysis, and local analysis. 【Features】 ■ Reduces thermal effects and refines generated particles for high precision using FHG f's laser ■ High-speed ablation with a galvanometer scanner ■ Enables high spatial resolution measurements with a minimum focal diameter of 1μmΦ ■ Equipped with a goniometer to correct sample tilt ■ Arbitrary setting of ablation shapes using a tablet device *For more details, please refer to the related links or feel free to contact us. Exhibition Participation JASIS 2023 Advanced Science and Analytical Systems & Solutions Exhibition Date: September 6-8, 2023, 10:00 AM - 5:00 PM Venue: Makuhari Messe International Exhibition Hall, 2-1 Nakase, Mihama-ku, Chiba City, Chiba Prefecture 261-0023 Booth: 4B-206

The "Vaplock system" is a sealed reagent supply and discharge system that can be attached to reagent bottles and waste liquid tanks. Thanks to its unique structure, it supplies and discharges reagents without volatilizing in the laboratory. A filter connected to the waste liquid bottle traps vapors that volatilize from the waste liquid. It is also compatible with GL38 and GL45 standard bottles, as well as poly tanks, making it useful for compliance with labor safety and health regulations. 【Features】 ■ Attaches to reagent bottles and waste liquid tanks ■ Supplies and discharges reagents without volatilizing in the laboratory due to its unique structure ■ High airtightness eliminates concerns about liquid leakage ■ Compatible with GL38 and GL45 standard bottles and poly tanks *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our generative AI specialized in data analysis. Through automation, the efficiency of the analysis center's operations has significantly improved. By reducing labor costs and unnecessary resources, we can greatly cut costs. Real-time data analysis is now possible in each department, supporting swift decision-making. By implementing advanced analytical technologies, we can secure a competitive advantage in the market. [Features] ■ Raman analysis can be performed without specialized knowledge ■ Improved work efficiency ■ Rapid decision-making ■ Cost reduction ■ Secured competitive advantage *For more details, please download the PDF or feel free to contact us.

The small giant, Raman EYE. Though compact in size, its analytical power is overwhelming. Conventional Raman spectrometers have been large and expensive, making them inaccessible to everyone. This product is the world's smallest Raman sensor that can be used simply by attaching it to your existing microscope.

The "QPM Optical Inspection System" is a system designed for high-precision quality inspection of semiconductor wafers and laser patterning processes. We offer system concepts tailored to your needs, including a semi-automatic type with manual workpiece supply and a mass production type compatible with CIGS lines. Currently, we are accelerating development towards systemization. We are also conducting test analyses as needed, so please feel free to consult with us. 【System Concept (Semi-Automatic Type)】 ■ Manual workpiece supply ■ Compatible with Φ300mm wafers ■ Small wafers can be accommodated with jig implementation *For more details, please feel free to contact us.

In the semiconductor industry, detailed compositional analysis of materials is essential due to the increasing performance requirements of products. Particularly in the quality control of wafers and thin films, localized component analysis and depth profiling are necessary. Traditional analytical methods often involve lengthy sample preparation and have limitations in analytical precision. The laser ablation device 'LASER BLENDER' achieves high-speed and high-precision LA-ICP analysis, addressing the challenges of analysis in semiconductor manufacturing. 【Usage Scenarios】 - Foreign substance analysis of wafers - Depth profiling of thin films - Localized analysis of fine structures 【Benefits of Implementation】 - Reduction in analysis time - Achievement of high-precision analytical results - Diversification of analytical methods

In the field of medical technology, precision machining requires the high-accuracy processing of fine structures and complex shapes. Particularly in the analysis of biological tissues and medical devices, it is crucial to efficiently obtain necessary information while minimizing damage to the samples. Traditional cutting methods have limitations due to tissue degeneration from thermal effects and constraints on processing accuracy. The laser ablation device 'LASER BLENDER' achieves high-speed and high-precision LA-ICP analysis, enabling localized, imaging, and depth-direction analysis through direct approaches to solid samples. This expands the scope of analysis in the medical field and accelerates research and development. 【Application Scenarios】 - Analysis of fine structures in biological tissues - Material analysis of medical devices - Evaluation of drug delivery systems - Depth-direction analysis of pathological tissues 【Benefits of Implementation】 - Detailed information acquisition through high-precision localized analysis - Minimization of thermal effects on samples - Reduction and efficiency improvement of analysis time - Advancement of research through diversification of analytical methods

In the automotive industry, surface modification technology is essential for improving the durability of parts and enhancing functionality. In particular, there is a demand for improved wear resistance of metal components and increased efficiency in the pre-treatment process before painting. Conventional surface modification technologies have faced challenges such as limitations in processing range and the complexity of analysis. The laser ablation device "LASER BLENDER" addresses these issues and contributes to the improvement of automotive parts quality. 【Application Scenarios】 - Surface modification of metal components - Pre-treatment before painting - Foreign substance analysis - Depth-direction analysis 【Effects of Implementation】 - High-speed and high-precision LA-ICP analysis - Pinpoint quality evaluation through localized analysis - Expansion of analytical methods - Simplification of the pre-treatment process

In the aerospace industry, reducing the weight of components is essential for improving performance and reducing costs. Material composition analysis plays a crucial role in the development of lightweight new materials. However, traditional analytical methods often take a long time or can destroy the samples. The laser ablation device 'LASER BLENDER' achieves high-speed and high-precision LA-ICP analysis, addressing the challenges of material analysis in the aerospace field. By directly approaching solid samples, it enables localized, imaging, and depth analysis, supporting rapid analysis and material development. [Application Scenarios] - Material analysis of aircraft components - Material analysis of rocket engines - Material analysis of space station components [Effects of Implementation] - Acceleration of material analysis - Improvement in analytical accuracy - Acceleration of new material development

In the circuit formation of the electronics industry, the precision and efficiency of microfabrication are crucial. Especially as high-density packaging advances, the accurate formation of circuit patterns significantly affects product performance and reliability. Traditional processing methods can pose challenges such as damage to surrounding materials due to thermal effects and lengthy processing times. The laser ablation device "LASER BLENDER" addresses these issues, enabling high-speed and high-precision circuit formation. 【Application Scenarios】 * Microfabrication of electronic circuit boards * Manufacturing of semiconductor devices * Production of MEMS devices * Modification of circuit patterns 【Benefits of Implementation】 * High-precision processing with minimized thermal effects * Increased productivity through high-speed ablation * High spatial resolution measurement with a minimum focal diameter of 1μmΦ * Capability for ablation of various shapes

In the solar cell industry, detailed analysis of materials is required for high performance and quality control. Particularly in thin-film solar cells and compound solar cells, analyzing the composition and structure of materials in detail is essential for improving efficiency and durability. Traditional analysis methods have faced challenges such as long analysis times and limited analysis ranges. The laser ablation device 'LASER BLENDER' achieves high-speed and high-precision LA-ICP analysis, addressing these challenges in the analysis of solar cell materials. 【Application Scenarios】 - Localized material analysis of solar cell cells - Depth-direction analysis of thin-film solar cells - Imaging analysis of solar cell materials 【Effects of Implementation】 - Reduction in analysis time - Improvement in analysis accuracy - Expansion of the analysis range

In the display industry, precise removal of thin films is required to efficiently manufacture high-quality products. Particularly in fine pattern formation and foreign material removal, high accuracy and speed are essential. Conventional removal methods may pose challenges such as damage to the substrate and long processing times. The "LASER BLENDER" addresses these issues through laser ablation technology. 【Application Scenarios】 - Thin film removal from display substrates - Foreign material removal - Fine patterning 【Benefits of Implementation】 - Improved yield through high-precision thin film removal - Increased productivity through high-speed ablation - Enhanced quality control through localized analysis, imaging, and depth analysis

In material analysis at research institutions, the analysis of elemental composition and structure in micro-regions of samples is required. Particularly in the evaluation of material properties and the development of new materials, detailed analysis in the depth direction from the surface is important. Conventional analytical methods have limitations in terms of sample damage and analytical precision. The "LASER BLENDER" is a laser ablation device that achieves high-speed and high-precision LA-ICP analysis. It enables direct approaches to solid samples, facilitating "local," "imaging," and "depth" analyses, thereby accelerating research and development. 【Application Scenarios】 - Local analysis of materials - Depth analysis of thin films - Foreign substance analysis - Element mapping 【Benefits of Implementation】 - Reduction in analysis time - High-precision analytical results - Expansion of analytical methods - Reduction of thermal impact on samples

In the textile industry, detailed analysis of fiber patterns is required for product quality control and research and development. Particularly in the development of new materials and the improvement of existing product quality, it is crucial to accurately understand the fine structure of patterns. Traditional analytical methods have faced challenges such as sample destruction and lengthy analysis times. The LASER BLENDER is a laser ablation device that achieves high-speed and high-precision LA-ICP analysis. It enables direct approaches to solid samples, allowing for "local," "imaging," and "depth" analysis, facilitating detailed analysis of fiber patterns. 【Application Scenarios】 - Quality evaluation of textile products - Development of new materials - Pattern analysis - Foreign substance analysis 【Benefits of Implementation】 - Minimization of impact on samples through non-destructive analysis - Reduction of analysis time through high-speed analysis - Detailed pattern analysis through local analysis - Expansion of the range of analytical methods