西進商事 Product Lineup

The "SS-30WD" is a device that enables various high-precision strength tests, such as wire pull tests and die shear tests, which are necessary for the inspection in the chip LED manufacturing process, all in one unit. Data management of measurement results and setting of measurement parameters can also be managed and configured using the included PC. Additionally, measurements can be conducted while heating as an option. We create various measurement jigs tailored to your measurement methods. We have delivered numerous devices for both LED development and mass production. 【Features】 ■ High reliability ■ Multiple product tests possible with one unit ■ Customizable measurement stage ■ Issuance of calibration certificates from JQA *For more details, please refer to the catalog or feel free to contact us.

This device can perform various high-precision strength tests, such as wire pull tests and die shear tests, which are required during the chip LED manufacturing process, all with a single unit. By adopting a high-precision micro-stepping motor, stable measurements can be achieved from ultra-low speeds to high speeds. Data management of measurement results and setting of measurement parameters can also be managed and configured using the accompanying PC. Additionally, measurements can be conducted while heating (optional).

We would like to introduce the laser scriber 'SS-400BG2' handled by Seishin Shoji Co., Ltd. This product is a device designed for scribing electronic component substrates using solid laser light. The compatible substrate material is mainly alumina ceramic. The target work sizes are 50mm×60mm and 60mm×70mm. *Requests for other sizes can also be accommodated. It is equipped with features such as processing position alignment, automatic control of processing height, and front-back alignment. 【Standard Specifications】 ■ 50mm×60mm and 60mm×70mm *Requests for other sizes can also be accommodated. ■ Loader/Unloader ■ Processing position alignment function ■ Automatic control of processing height function ■ Front-back alignment function *For more details, please refer to the related link page or feel free to contact us.

【For images, please watch the video】 We select laser oscillators tailored to customer requests, accommodating various laser processing applications! Our experienced technical staff is always available for consultations regarding lasers. Sample processing is conducted free of charge. 【Many achievements】 Our company has a wealth of sales experience in laser processing machines for the development and mass production of fine and precision processing applications using "lasers." In particular, we have over 300 installations of laser processing machines for chip resistors and alumina ceramics. Leveraging 20 years of knowledge and experience in laser processing, we propose optical systems and oscillators that meet the material and processing requirements. We can manufacture equipment according to customer preferences! For customers considering purchasing equipment, we offer free sample processing.

The "SS-200PC" from Seishin Shoji is a high-precision printing system equipped with computer control functions for printing conditions and pattern recognition. It not only maintains advanced printing accuracy but also enables high productivity and easy handling. Furthermore, it aims for a systematic deployment to meet the rigorous usage requirements of each user, going beyond just equipment sales. It is ideal for printing fine patterns such as microchip resistors and LTCC. 【Features】 ■ Equipped with computer control functions for printing conditions ■ High-precision printing system with pattern recognition *For more details, please refer to the catalog or feel free to contact us.

The "SS-1600SS" is a double-head automatic printing system designed for mass production. It not only maintains high printing accuracy but also enables high productivity and easy handling. Furthermore, it aims for a systematic deployment to meet the stringent usage requirements of each user, going beyond just equipment sales. It is ideal for printing fine patterns such as microchip resistors and LTCC. 【Features】 ■ Capable of mass printing ■ Capable of automatic printing *For more details, please refer to the catalog or feel free to contact us.

The "SS-100W" is a double automatic screen printing system for chip resistors that enables high-precision screen printing through our unique center positioning mechanism. By supplying the printing functions of two machines simultaneously to a single drying and firing system, we have achieved a reduction in production processes, a decrease in layout space, and a rationalization of labor, resulting in improved productivity and significant cost reductions as a total system. Additionally, by adopting a compact printing head, we are further reducing layout space. 【Features】 ■ Reduction of layout space ■ Rationalization of labor ■ High-precision positioning accuracy *For more details, please refer to the catalog or feel free to contact us.

The "SS-2000 Series" is a device that automatically inspects the multi-faceted appearance of chip components with high precision and accuracy. From fine chip components such as 0402 and 0603 sizes to special sizes of 1005 to 3216 and above, it enables size compatibility, multi-faceted inspection, high-speed inspection, and high-precision inspection through its unique work transport method and comprehensive inspection software. 【Features】 ■ Capable of inspecting a wide range of products from two-electrode to multi-terminal products ■ Supports inspection of six or more surfaces ■ Allows for size compatibility through disk exchange ■ Options for color cameras and high-resolution cameras available ■ Capable of inspecting round samples with pin shape types *For more details, please refer to the catalog or feel free to contact us.

We would like to introduce the "Laser Device for LED" handled by Seishin Shoji Co., Ltd. This product is designed for processing substrates for LEDs and LDs using solid laser light (ablation, laser lift-off, etc.). The target work size is up to 4 inches, and it is equipped with processing position alignment functionality and work thickness correction functionality. It is compatible with sapphire, gallium nitride, and silicon carbide. 【Standard Specifications】 ■ Target work size: Up to 4 inches ■ Transport robot ■ Processing position alignment functionality ■ Work thickness correction functionality ■ Laser output management functionality *For more details, please refer to the related link page or feel free to contact us.

Equipped with Hamamatsu Photonics' patented technology "Stealth Dicing Engine," it has become possible to cut transparent materials that were previously said to be difficult to process with precision and high accuracy. We offer free sample processing, so please feel free to contact us. 【Features】 ■ Target materials SiC (silicon carbide), LT (lithium tantalate)/LN (lithium niobate), GaN (gallium nitride), reinforced glass, glass ■ Processing of thin samples under 100μ is also possible ■ Achieves high throughput through high-speed/high-precision processing *For more details, please contact us or download the PDF.

The "SS-30WD" is a multi-type strength testing machine that can accurately measure various strengths such as wire pull, die shear, and peel strength. By simply changing the installation direction of the load cell, it is possible to handle pull, peel, push, and shear tests with a single unit. By adopting a high-precision micro-stepping motor, stable measurements can be achieved from ultra-low speed to high speed. 【Features】 ■ Capable of handling pull, peel, push, and shear tests with one unit ■ Equipped with a high-precision micro-stepping motor ■ Stable measurements possible from ultra-low speed to high speed ■ The dedicated data processing software automatically captures load fluctuation graphs immediately after measurement ■ Custom solutions tailored to workpieces and measurement content, such as jigs and tools, are available *For more details, please refer to the related link page or feel free to contact us.

Are you having trouble removing rust and dirt from machine parts? With the JPT Laser Cleaner CL100, you can do it efficiently. Here are three highlights of this product! ◾️ Lightweight design suitable for long-term use. The head weighs only 620g. ◾️ Easy settings with a wireless remote control. ◾️ Affordable price range for easy introduction. Laser Cleaning For those considering laser cleaning!

In the automotive industry, the bonding strength of components is crucial for ensuring safety and durability. In particular, the strength of joints using adhesives or welding directly affects vehicle safety. Evaluating bonding strength requires various testing methods, but using different testing machines for each method can be costly and time-consuming. The bond tester 'SS-30WD' accommodates a variety of tests such as shear, pull, peel, and push, meeting all needs for evaluating bonding strength. 【Application Scenarios】 - Adhesive strength testing of body parts - Bonding strength testing of interior components - Mounting strength testing of electronic components 【Benefits of Implementation】 - Supports a variety of tests with a single machine, reducing costs and time associated with testing - Enables reliable data acquisition through high-precision measurements - Improves analysis efficiency with data processing software

In the electronics industry, product reliability is one of the most important issues. The bonding strength of electronic components is a crucial factor that affects the durability and performance of products, and poor bonding can lead to early product failure. The bond tester 'SS-30WD' supports a variety of tests such as shear, pull, peel, and push, meeting all needs for reliability evaluation of electronic devices. 【Usage Scenarios】 - Evaluation of bonding strength of electronic components - Strength testing of semiconductor packages - Reliability assessment of surface-mounted components - Quality control of electronic devices 【Benefits of Implementation】 - Improvement in product quality - Reduction of defective products - Gaining customer trust - Shortening of product development time

In the aerospace industry, the strength of joint connections is crucial for ensuring product safety. Particularly for components used in harsh environments, the reliability of these joints significantly affects the product's performance and safety. Inadequate joint strength can lead to serious accidents. The bond tester 'SS-30WD' accommodates a variety of tests such as shear, pull, peel, and push, meeting all strength evaluation needs in the aerospace sector. 【Application Scenarios】 - Strength testing of aircraft component joints - Strength evaluation of structural materials in spacecraft - Quality control of components where safety is a concern 【Benefits of Implementation】 - Improved product safety through enhanced joint reliability - Increased evaluation accuracy by accommodating diverse tests - Strengthened quality management system with the inclusion of JQA calibration certificates

In the quality control of the medical device industry, the strength of joints is crucial to ensure the safety and reliability of products. Particularly in medical devices that relate to patient safety, delamination or damage at the joints can lead to serious accidents. The bond tester 'SS-30WD' accommodates a variety of tests such as shear, pull, peel, and push, thoroughly evaluating joint strength. 【Usage Scenarios】 - Quality control in the manufacturing process of medical devices - Evaluation of parts requiring joint strength - Durability testing of products 【Benefits of Implementation】 - Improvement in product quality - Reduction of accident risks - Provision of highly reliable products

In the packaging industry, ensuring the seal integrity of packaging materials is crucial for maintaining product quality. Proper sealing of packaging materials is essential to prevent damage during transportation and contamination by foreign substances. Inadequate sealing can lead to product quality deterioration and complaints. The bond tester 'SS-30WD' supports quality management by evaluating the seal integrity of packaging materials through various strength tests. 【Usage Scenarios】 - Seal strength testing of packaging materials for food, pharmaceuticals, cosmetics, etc. - Early detection of sealing defects in packaging materials - Quality control of packaging lines 【Benefits of Implementation】 - Improvement in packaging material quality - Assurance of product safety - Reduction in complaint occurrence rate

In the semiconductor industry, evaluating the strength of fine joints is crucial to ensure product reliability. Particularly as miniaturization progresses, even slight abnormalities in joints can affect the overall performance of the product. Variations in joint strength and poor bonding not only reduce product yield but also compromise the reliability of the final product. The bond tester 'SS-30WD' accommodates a variety of tests such as shear, pull, peel, and push, meeting all needs for strength evaluation of fine joints. 【Application Scenarios】 - Shear tests for die, ball, and bump - Wire pull tests - Peel tests (90°/180°) - Push tests 【Benefits of Implementation】 - Wide joint evaluation due to support for various tests - Reliable data acquisition through high-precision measurements - Improved analysis efficiency with data processing software - Quality assurance with JQA calibration certificates

In the food industry, it is important to minimize the risk of foreign matter contamination to ensure product safety. Foreign matter contamination can lead to health hazards for consumers and a loss of trust for companies. The bond tester 'SS-30WD' helps reduce the risk of foreign matter contamination through strength testing of food packaging materials. 【Usage Scenarios】 - Seal strength testing of food packaging materials - Quality control of packaging materials to prevent foreign matter contamination - Impact resistance testing of food containers 【Benefits of Implementation】 - Evaluates the strength of packaging materials and reduces the risk of foreign matter contamination - Strengthens the quality management system of products - Protects consumer safety and maintains corporate trust

In the energy industry, proper strength evaluation of insulating materials is essential to ensure product safety and reliability. Particularly for insulating materials exposed to high temperatures and high voltages, their strength significantly affects product performance and safety. Inadequate strength evaluation can lead to accidents or performance degradation due to insulation failure. The bond tester 'SS-30WD' supports shear, pull, peel, and push tests, addressing all needs for strength evaluation of insulating materials. [Application Scenarios] - Adhesive strength testing of insulating materials - Terminal joint strength testing of wires and cables - Strength testing of insulating insulators [Benefits of Implementation] - Supports a variety of tests, improving the efficiency of evaluation tasks - High-precision measurements provide reliable data acquisition - Data management software streamlines analysis and report creation

In the MEMS industry, the miniaturization and high-density integration of devices are advancing, requiring precise processing technologies. In particular, high precision and yield are challenges in the fine processing of hard materials such as sapphire and SiC, as well as special materials like quartz and LiNbO₃. The stealth dicing laser processing machine addresses these challenges by achieving high-speed and high-quality processing. 【Application Scenarios】 - Dicing of MEMS devices - Processing of smartphone components - Manufacturing of LED-related parts 【Benefits of Implementation】 - Improved yield by reducing fine cracks and chipping - Shortened production takt time through high-speed processing - Compatibility with a wide variety of materials

In the electronic components industry, as miniaturization and high density progress, there is a demand for smaller and more precise processing. Particularly in the processing of transparent materials, it is important to suppress fine cracks and chipping to improve yield. The stealth dicing-equipped laser processing machine incorporates Hamamatsu Photonics' patented technology, the stealth dicing engine, to address these challenges. 【Application Scenes】 - Smartphone components - LED-related components - Processing of special materials such as SiC, sapphire, quartz, and LiNbO₃ 【Effects of Introduction】 - Improved yield through high-precision dicing - Reduced production takt time through high-speed processing - Compatibility with a wide variety of materials - Adaptation to small chip sizes

In the display industry, as the trend towards thinner products continues, there is a demand for precise cutting of transparent materials such as glass substrates. The conventional blade method tends to cause fine cracks and chipping, which can lead to reduced yield and unstable quality. The stealth dicing laser processing machine, equipped with Hamamatsu Photonics' patented Stealth Dicing Engine, addresses these challenges. 【Application Scenarios】 - Manufacturing of thin displays - Precision processing of transparent materials - Yield improvement 【Benefits of Implementation】 - Improved yield through high-precision dicing - Increased productivity through high-speed processing - Compatibility with a wide range of materials

In the solar cell industry, there is a demand for both high performance and cost reduction. In particular, improving the yield of materials and reducing processing time are critical challenges in the manufacturing of solar cell cells. Conventional blade cutting methods are prone to fine cracks and chipping, which can lead to decreased yield. The stealth dicing laser processing machine is equipped with Hamamatsu Photonics' patented stealth dicing engine, enabling high-precision dicing of transparent materials. This contributes to improved yield and stabilized quality. Additionally, high-speed processing through laser irradiation allows for a reduction in production takt time. 【Application Scenarios】 - Cutting processing of solar cell cells - Yield improvement through high-precision dicing - Processing of hard materials such as SiC and sapphire 【Effects of Implementation】 - Improved yield - Increased productivity - Stable supply of high-quality products

In the aerospace industry, weight reduction is a critical issue, and hard materials such as sapphire and SiC, as well as special materials like quartz, are used for aircraft and component materials. The precise processing of these materials significantly affects product performance and reliability. Laser processing machines equipped with stealth dicing achieve high-precision processing for these transparent materials, contributing to improved yield and stabilized quality. 【Application Scenarios】 - Precision processing of hard materials such as sapphire and SiC - Processing of special materials like quartz and LiNbO₃ - Component manufacturing aimed at weight reduction 【Effects of Implementation】 - Improved yield by suppressing fine cracks and chipping - Reduced production takt time through high-speed processing - Establishment of a flexible production system capable of handling a wide variety of materials

In the automotive industry, the miniaturization and high performance of electrical components are progressing, leading to a demand for precise cutting processes of substrates and electronic components. In particular, automotive electronic components require high reliability under harsh conditions, making processing accuracy and quality crucial. Laser processing machines equipped with stealth dicing achieve high-precision dicing of transparent materials and contribute to improved yield and stabilized quality by suppressing fine cracks and chipping. 【Application Scenarios】 - Processing of automotive sensor components - Processing of LED headlight components - Manufacturing of small electronic components 【Benefits of Implementation】 - Improved yield through high-precision cutting processes - Reduced production takt time - Compatibility with a wide range of materials

In the IoT device industry, miniaturization and energy efficiency are important challenges. As devices become more high-performance, precise processing of circuit boards and components is required. In particular, components made from transparent materials necessitate high-precision cutting through laser processing, which is essential for improving yield and enhancing device reliability. Stealth dicing laser processing machines enable fine processing of transparent materials, contributing to the miniaturization, high performance, and energy efficiency of IoT devices. 【Application Scenarios】 - Smartphone components - LED-related components - Wearable devices 【Effects of Implementation】 - Improved yield - Reduced production takt time - Support for small chip sizes - Stable supply of high-quality products

In the wearable device industry, miniaturization and lightweight design are advancing, leading to a demand for precise cutting of transparent materials. In particular, microfabrication technology is crucial to accommodate the thinning of devices and high-density mounting. Conventional processing methods are prone to material cracking and chipping, which can lead to reduced yield and unstable quality. Our laser processing machine equipped with stealth dicing enables precise processing of transparent materials, contributing to the improvement of wearable device quality. 【Application Scenarios】 - Processing of transparent covers for compact and lightweight devices - Cutting of display components - Manufacturing of LED-related parts 【Benefits of Implementation】 - Improved yield - Stable supply of high-quality products - Reduced production takt time

In the optical components industry, precise cutting of transparent materials such as lenses and prisms is required. In particular, the processing accuracy that affects product performance and high-quality processing to improve yield are crucial. The conventional blade method tends to cause fine cracks and chipping, which leads to a decrease in yield. Our laser processing machine equipped with the stealth dicing technology, patented by Hamamatsu Photonics, addresses these challenges. 【Application Scenarios】 - Manufacturing of optical components such as lenses, prisms, and filters - Cutting of transparent materials such as sapphire, SiC, quartz, and LiNbO₃ - Precision processing of smartphone components, LED-related parts, and more 【Benefits of Implementation】 - Reduces fine cracks and chipping, improving yield - Shortens production takt time through high-speed processing - Accommodates a wide variety of materials, establishing a flexible production system

In prototype development at research institutions, precise processing of diverse materials is required. Particularly in the processing of transparent materials, it is important to suppress fine cracks and chipping to create high-quality samples. The stealth dicing-equipped laser processing machine is equipped with Hamamatsu Photonics' patented technology, the stealth dicing engine, enabling high-precision dicing of transparent materials. 【Application Scenarios】 - Research and development using transparent materials - Production of prototypes - Material property evaluation 【Effects of Introduction】 - Production of high-quality prototypes - Improved yield - Increased efficiency in research and development