Amazing processing speed! Replacement of dicing with laser! High-speed, high-quality, and high-precision cutting of transparent materials is now possible!
Equipped with Hamamatsu Photonics' patented technology "Stealth Dicing Engine," it has become possible to cut transparent materials that were previously said to be difficult to process with precision and high accuracy. We offer free sample processing, so please feel free to contact us. 【Features】 ■ Target materials SiC (silicon carbide), LT (lithium tantalate)/LN (lithium niobate), GaN (gallium nitride), reinforced glass, glass ■ Processing of thin samples under 100μ is also possible ■ Achieves high throughput through high-speed/high-precision processing *For more details, please contact us or download the PDF.
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Since its establishment on March 10, 1952, Seishin Shoji Co., Ltd. has introduced a variety of products to the domestic market. As a trading company, it has particularly contributed to the field of analysis, starting with the import of analytical standard materials. Additionally, while it has been active as a technical trading company in the electronic components industry, in recent years it has expanded not only as a trading company but also into the design and manufacturing of new electronic devices, making significant strides in the manufacturing sector and achieving a wide range of activities both domestically and internationally.