Laser processing machine equipped with stealth dicing for optical components.

Achieving high-speed, high-quality, and high-precision cutting processing of transparent materials!

In the optical components industry, precise cutting of transparent materials such as lenses and prisms is required. In particular, the processing accuracy that affects product performance and high-quality processing to improve yield are crucial. The conventional blade method tends to cause fine cracks and chipping, which leads to a decrease in yield. Our laser processing machine equipped with the stealth dicing technology, patented by Hamamatsu Photonics, addresses these challenges. 【Application Scenarios】 - Manufacturing of optical components such as lenses, prisms, and filters - Cutting of transparent materials such as sapphire, SiC, quartz, and LiNbO₃ - Precision processing of smartphone components, LED-related parts, and more 【Benefits of Implementation】 - Reduces fine cracks and chipping, improving yield - Shortens production takt time through high-speed processing - Accommodates a wide variety of materials, establishing a flexible production system

Laser marker