Achieving high density! High-speed and high-quality cutting processing of transparent materials.
In the electronic components industry, as miniaturization and high density progress, there is a demand for smaller and more precise processing. Particularly in the processing of transparent materials, it is important to suppress fine cracks and chipping to improve yield. The stealth dicing-equipped laser processing machine incorporates Hamamatsu Photonics' patented technology, the stealth dicing engine, to address these challenges. 【Application Scenes】 - Smartphone components - LED-related components - Processing of special materials such as SiC, sapphire, quartz, and LiNbO₃ 【Effects of Introduction】 - Improved yield through high-precision dicing - Reduced production takt time through high-speed processing - Compatibility with a wide variety of materials - Adaptation to small chip sizes
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【Features】 - High-precision dicing of transparent materials - Process efficiency and productivity improvement - Wide range of material compatibility - Support for fine processing - Free sample processing available 【Our Strengths】 Nishishin Shoji Co., Ltd. leverages years of experience and know-how to provide optimal processing solutions tailored to customer needs. We also design and manufacture electronic component production equipment, contributing to solving customer challenges.
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Since its establishment on March 10, 1952, Seishin Shoji Co., Ltd. has introduced a variety of products to the domestic market. As a trading company, it has particularly contributed to the field of analysis, starting with the import of analytical standard materials. Additionally, while it has been active as a technical trading company in the electronic components industry, in recent years it has expanded not only as a trading company but also into the design and manufacturing of new electronic devices, making significant strides in the manufacturing sector and achieving a wide range of activities both domestically and internationally.
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