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We have developed a phosphor plate composed solely of ceramic components by utilizing our long-established handling technology for ceramic particles. Not only does it excel in heat and light resistance, but it also allows for the easy application of high-performance and delicate phosphors, achieving a balance of high color rendering and efficiency. Additionally, because we utilize printing technology, it can accommodate various sizes and shapes.
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Free membership registrationWe handle various structural fine ceramics products made from main raw materials such as alumina, zirconia, silicon nitride, silicon carbide, and sialon.
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Free membership registrationThis is an ultra-precise vacuum chuck made using Poafree-type ceramic materials, pursuing ultimate planar smoothness. It accommodates various types of wafers and guarantees smoothness even in the currently mainstream φ300mm size.
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Free membership registrationWe offer a lineup of electrostatic chucks that utilize various material technologies to meet user needs. We provide products tailored to applications such as plasma environments, electron beam usage, and ultra-low expansion specifications, from the development and prototyping stages.
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Free membership registrationThrough planar smoothness and special manufacturing techniques, we provide high productivity and reliability in manufacturing processes that require full adhesion of wafers and large substrates, with excellent adsorption characteristics and high durability. The porous body offers flexibility in the selection of materials and pore size according to user needs.
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Free membership registrationThis is a groundbreaking material that achieves zero expansion equivalent to ultra-low expansion recrystallized glass while maintaining the high rigidity of ceramics.
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Free membership registrationThrough the collaboration between the thermal spraying equipment manufacturer "Aero Plasma" and the ceramics materials technology of Japan Ceratec, we have established a ceramic thermal spraying technology with infinite possibilities, including ultra-dense, high voltage resistance, and plasma resistance characteristics.
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