CMインダストリー Product Lineup

Our "Cold Plate" is designed for use in various situations where it is necessary to efficiently absorb and transfer large amounts of heat. To accommodate applications with limited space, we pursue high thermal conductivity and a compact design. The flow paths for heat transfer fluids can be processed into various shapes and sizes through different manufacturing methods. The materials used are aluminum or copper, which can be processed into thin forms, contributing to weight reduction. Please utilize it for the development of temperature-sensitive products such as lithium-ion batteries. 【Main Manufacturing Methods】 ■ Friction Stir Welding (FSW): Allows for high fatigue strength and minimal distortion in joints. ■ Vacuum Brazing: Suitable for small quantities, enabling complex joint shapes and multiple joint locations. ■ Metal Pipe Embedding: Cost-effective for mass production. ■ Metal Diffusion Bonding ■ Gundrilling *For more details, please refer to the documentation. Feel free to contact us with any inquiries.

• Other electronic parts
• Cooling system

Our company takes pride in being a Thermal Solution Provider and offers various thermal management solutions to our customers. In line with your requests, whether cost-focused or performance-oriented, we propose suitable methods using thermal fluid simulation software (ANSYS) before creating drawings. In addition, we offer a variety of services and products such as cold plates, vapor chambers, heat pipes, and heat sinks. 【Features】 ■ Right material for the right place - We manage several overseas vendors and utilize their strengths according to the project. ■ High quality / Cost-focused - Delivery of high-quality products through inspections conducted domestically. *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Cooling system
• Other services

In applications where high heat generation and limited space are present, cold plates have become essential due to their combination of high thermal conductivity and compact design. Cold plates are typically made of metal, with channels machined to allow heat transfer fluids to flow through. Depending on the manufacturing method, these channels can be shaped and sized in various ways to absorb and transfer large amounts of heat more effectively. The effectiveness of heat transfer varies based on the available surface area in the channels, the liquid used, the flow rate of the liquid, and the materials used in the cold plate. 【Product Lineup】 ■ FSW Friction Stir Welding ■ Vacuum Brazing ■ Pipe Embedding ■ Gundrilling *For more details, please refer to the PDF materials or feel free to contact us.

• Other electronic parts
• Cooling system

A "vapor chamber" is a mechanism that operates on principles similar to heat pipes, which dissipate thermal load and liquefy when in contact with a cold surface. It has far superior thermal performance compared to conventional solid metal heat spreaders, making it suitable for applications where miniaturization and high thermal diffusion performance are required. Like heat pipes, it is expected to see increasing demand for use in mobile devices due to its thin profile and as a base for heat sinks that leverage its excellent thermal diffusion properties. 【Vapor Chamber Structure】 ■ Top Cover ■ Mesh/Wick ■ Copper Sintered Support ■ Mesh/Wick ■ Bottom Cover ■ Liquid Inlet *For more details, please refer to the PDF document or feel free to contact us.

• Cooling system

With the miniaturization and high performance of electronic devices, the power consumption and heat generation are also increasing. The heat transfer capacity of heat pipes is insufficient, and vapor chambers are beginning to be used in mobile devices as a substitute for heat pipes. We offer "Slim Vapor Chambers" with thicknesses of 0.4mm, 0.3mm, and 0.25mm for use in mobile devices. 【Slim Vapor Chamber Specifications (Excerpt)】 <Maximum design dimensions are uniformly 100×100mm> ■ Thickness 0.3mm (Input heat capacity 5.5W) ■ Thickness 0.35mm (Input heat capacity 9W) ■ Thickness 0.4mm (Input heat capacity 9W) ■ Thickness 0.45mm (Input heat capacity 12W) ■ Thickness 0.5mm (Input heat capacity 14W) *For more details, please refer to the PDF document or feel free to contact us.

• Cooling system
• Other electronic parts

"Heat pipes" are two-phase flow cooling technologies, such as heat pipes and vapor chambers, that are effective in situations where there is a high heat load or limited space for heat sinks. Due to minimal resistance in thermal diffusion, they exhibit performance far superior to solid metals in thermal conduction and are primarily used in high-spec environments where space-saving and high performance are both required. From this perspective, the field is continuously evolving to meet the high demands for thinner structures and the miniaturization and high performance of electronic devices. 【Lineup】 ■ Mesh ■ Groove ■ Copper Sintered Powder ■ Fiber ■ Composite *For more details, please refer to the PDF document or feel free to contact us.

• Cooling system

In modeling for cooling targets, when designers repeat the process of design → prototyping → measurement through experiments → redesign → prototyping based on their experience, it leads to wasted time and costs. In short, CFD analysis is necessary to eliminate that waste. In CFD, as long as the input parameters are provided, calculations are performed automatically, allowing for the visualization of fluid flow and temperature distribution. Our company conducts analysis using Ansys Icepak to assist in the design process. *For more details, please refer to the PDF materials or feel free to contact us.*

• Thermo-fluid analysis

We offer large, high-performance, and durable heat sinks as a heat dissipation solution for high-heat devices such as industrial IGBTs and communication base stations. We provide optimal heat dissipation solutions through various manufacturing methods tailored to the application, including size and environment. [Heat Sink Structures and Manufacturing Methods] ■ Aluminum Extrusion ■ Skyv Processing ■ Stacked Fins ■ Solder-Free, Press-Fit, Stacked Fins ■ IGBT Heat Sinks for Transportation Vehicles ■ Fin Shapes *For more details, please refer to the PDF materials or feel free to contact us.

• Cooling system