ロバテックジャパン Company Overview

Are you looking for the ideal adhesive system for packaging processes? Robatech will showcase adhesive application systems that meet various performance requirements at Booth G70 in Hall 11. ✔️ Reliable systems suitable for basic applications ✔️ Versatile systems that optimize adhesive consumption ✔️ High-performance solutions for advanced production processes Please be sure to visit the Robatech booth.

Sirius is a new pattern controller from Robatech that integrates pattern monitoring functionality. It provides maximum flexibility and efficiency to customers across a wide range of industries in cold glue and hot melt applications. The modular design of Sirius has been developed as a successor to the traditional AS 30, AS 50, and AS 60 controllers and can be used for adhesive application in diverse production lines. - Up to 200 channels of application control and pattern monitoring - Flexible user interface that can be operated and configured from mobile devices or computers - Precise application control on high-speed lines with booster modules The Sirius pattern controller can be used not only with Robatech's adhesive application systems but also in conjunction with systems from third-party suppliers.

Robatech Japan Co., Ltd., the Japanese subsidiary of Robatech AG, has started selling its new product "Canduro 2" from January 8, 2026. Canduro 2 is a next-generation PUR adhesive melter developed for the melting and pumping of 2/2.5kg candle-shaped PUR adhesives. Specialized for on-demand melting applications, it features excellent maintainability and the latest RCS electronic control system. This product achieves higher reliability and operability as a successor to the conventional model RobaPUR 2 MOD. Due to its modular design, it can accommodate a wide range of applications, including pre-melters for roll coater filling, PUR adhesive melters for bead and dot application, continuous/intermittent coating applications, and various applications using manual applicators or robots. With on-demand melting technology (MOD), it melts only the necessary amount of adhesive, thereby suppressing the degradation of PUR adhesives and contributing to the reduction of material waste and cost.