ロバテックジャパン List of News Articles

This project started from an unusual inquiry to Robatech South Africa. The inquiry was from EnviroWrap, a company that manufactures surface protection materials, wanting to apply their protective agent to their products. Through collaboration with the project sales team (PST) at Robatech's headquarters in Switzerland and repeated testing, this project was ultimately realized. This technology is still in its early stages, but it has already succeeded in the initial system implementation. Currently, multiple systems are operational in the United States, being utilized for the protection of aluminum profiles and windows during manufacturing, transportation, and installation. For more details, please refer to the newsroom at the link URL.

Paper packaging refers to the use of paper-based packaging materials instead of plastic films. The paper stabilizes the product, and the adhesive secures the packaging. For pallet packaging, Robatech has developed a precise cold glue spiral application technology for bonding paper together. In paper band packaging, reliable hot melt adhesive beads are used. Both solutions contribute to reducing CO₂ emissions and improving the recyclability of packaging.

Sealing cardboard boxes by hand with adhesive tape—this process was included in the packaging process of Fatra's LVT flooring panels until 2024. However, this task was time-consuming, physically demanding, and required many employees. The company, a Czech plastic processing manufacturer, has fully automated this process by introducing a new packaging line. For more details, please visit Robatech's website / newsroom.

The precise cold glue spiral application and uniform application width achieve a reliable and clean production process. It enables economical bonding in paper packaging, lightweight cardboard manufacturing, and applications using robots. The Polaris, which eliminates dynamic seals and adopts electric drive, joins the lineup of cold glue application heads that excel in durability and maintenance.

Are you looking for the ideal adhesive system for packaging processes? Robatech will showcase adhesive application systems that meet various performance requirements at Booth G70 in Hall 11. ✔️ Reliable systems suitable for basic applications ✔️ Versatile systems that optimize adhesive consumption ✔️ High-performance solutions for advanced production processes Please be sure to visit the Robatech booth.

Sirius is a new pattern controller from Robatech that integrates pattern monitoring functionality. It provides maximum flexibility and efficiency to customers across a wide range of industries in cold glue and hot melt applications. The modular design of Sirius has been developed as a successor to the traditional AS 30, AS 50, and AS 60 controllers and can be used for adhesive application in diverse production lines. - Up to 200 channels of application control and pattern monitoring - Flexible user interface that can be operated and configured from mobile devices or computers - Precise application control on high-speed lines with booster modules The Sirius pattern controller can be used not only with Robatech's adhesive application systems but also in conjunction with systems from third-party suppliers.

Robatech Japan Co., Ltd., the Japanese subsidiary of Robatech AG, has started selling its new product "Canduro 2" from January 8, 2026. Canduro 2 is a next-generation PUR adhesive melter developed for the melting and pumping of 2/2.5kg candle-shaped PUR adhesives. Specialized for on-demand melting applications, it features excellent maintainability and the latest RCS electronic control system. This product achieves higher reliability and operability as a successor to the conventional model RobaPUR 2 MOD. Due to its modular design, it can accommodate a wide range of applications, including pre-melters for roll coater filling, PUR adhesive melters for bead and dot application, continuous/intermittent coating applications, and various applications using manual applicators or robots. With on-demand melting technology (MOD), it melts only the necessary amount of adhesive, thereby suppressing the degradation of PUR adhesives and contributing to the reduction of material waste and cost.