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  1. Home
  2. Electronic Components and Semiconductors
  3. Ito Corporation
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Electronic Components and Semiconductors
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Ito Corporation

EstablishmentOctober 1946
capital5000Ten thousand
number of employees27
addressTokyo/Chuo-ku/1-6-3 Nihonbashi Bakurocho
phone03-3668-3222
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last updated:Feb 29, 2024
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Tabletop / Standalone Atmospheric Pressure Plasma Device

A wide variety of simple tabletop atmospheric pressure plasma devices and direct-type devices are featured.

We would like to introduce our "Tabletop / Standalone Atmospheric Pressure Plasma Devices." Starting with the simple tabletop atmospheric pressure plasma device "MyPL series," we also offer the standalone "ILP series," direct plasma devices using inert argon as the carrier gas, and the atmospheric pressure plasma head unit "MD series" that utilizes argon gas. Additionally, we provide a bar-type atmospheric pressure plasma unit using N2, which can irradiate curved and uneven workpieces. 【Product Lineup】 ■ Tabletop Atmospheric Pressure Plasma Device "MyPL series" ■ Atmospheric Pressure Plasma Device "ILP series" ■ Direct Plasma Device ■ Atmospheric Pressure Plasma Head Unit "MD series" ■ Long-Distance Irradiation N2 Plasma Unit *For more details, please refer to the PDF materials or feel free to contact us.

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Proposal for Inline Processing Using Atmospheric Pressure Plasma

An inline solution using atmospheric pressure plasma that can be easily integrated into production lines! It contributes to cost reduction by reducing the number of operators!

Atmospheric pressure plasma, unlike vacuum plasma, has the advantage of being easily integrated into your production line. By implementing inline processing, it is possible to reduce the number of operators. The takt time can be significantly shortened, and by automatically feeding, processing, and discharging, variations in processing can be prevented. We will propose suitable plasma units tailored to your production line configuration. 【Expected Effects of Inline Processing】 ■ Reduction of operators is possible ■ Prevents variations in processing by automatically feeding, processing, and discharging ■ Takt time can be significantly shortened *For more details, please request materials or view the PDF data available for download.

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High-speed response, ultra-fine and ultra-thin thermocouples

High-precision measurements are possible! We assist you with a fast-response thermocouple for the temperature you want to know.

This product is a thermocouple that enhances heat input efficiency and minimizes heat loss through a specially designed ultra-fine thermocouple tip with a minimum diameter of 13μm, achieving high-speed responsiveness. When measuring significant temperature changes or in cases of rapid temperature cycling, the responsiveness of the temperature measurement sensor is extremely important. In temperature measurement using thermocouples, the heat dissipation from the thermocouple tip and the contact area affect responsiveness. 【Special Processing (Partial)】 ■ Tip bending processing ■ Tip circular processing ■ Screw-mounted samples ■ SUS tube insertion *For more details, please refer to the PDF document or feel free to contact us.

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ACF・Silicone rubber sheet for heat pressing (buffer material・cushion rubber)

Ideal for HC sheet replacement.

This product is ideal as a substitute for the discontinued Shin-Etsu Chemical HC sheets (HC-20MS, HC-30MS, HC-45MS). It has thermal conductivity (internal temperature of ACF), cushioning performance, and durability equivalent to that of HC sheets during ACF thermal bonding. Depending on specifications such as thickness and width, we can accommodate orders starting from approximately 10 reels in small quantities.

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Silicone rubber sheet for ACF and thermal bonding for electronic devices

For shock absorption in precision machinery. Ideal as a substitute for HC sheets.

In the electronics industry, as products become smaller and more high-performance, it is important to protect the internal precision components from shocks and vibrations. Particularly in electronic devices with ACF (Anisotropic Conductive Film) implementation, the pressure during thermal pressing and external shocks greatly affect the product's reliability. Our silicone rubber sheets for ACF thermal pressing serve as an alternative to HC sheets (HC-20MS, HC-30MS, HC-45MS), providing equivalent thermal conductivity (internal temperature of ACF), cushioning performance, and durability during ACF thermal pressing. 【Application Scenarios】 - Precision instruments - FPD (Flat Panel Display) - Electronic components requiring ACF implementation 【Benefits of Implementation】 - Alternative to HC sheets - Compatibility with various sizes - Orders accepted from small quantities

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Silicone rubber sheet for ACF bonding for displays

Silicone rubber sheet for CF bonding of precision instrument displays

Our ACF thermal bonding silicone rubber sheet serves as an alternative to HC sheets, achieving thermal conductivity, cushioning performance, and durability during ACF thermal bonding. 【Application Scenarios】 - ACF mounting process for displays - Replacement for HC sheets 【Benefits of Implementation】 - Improved reliability of ACF mounting - Potential cost reduction

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Silicone rubber sheet for ACF bonding for precision instruments

For ACF implementation and mass production of precision machinery. Ideal as a substitute for HC sheets.

In the precision machinery industry, the miniaturization and enhancement of product functionality are advancing, making ACF (Anisotropic Conductive Film) implementation technology essential. In ACF implementation, uniform pressure and temperature management during thermal pressing are crucial factors that influence the reliability of the bonding. Improper pressing can lead to poor conductivity and early product failure. Our ACF thermal pressing silicone rubber sheets serve as alternatives to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation and longevity of precision machinery. 【Application Scenarios】 - Thermal pressing in the ACF implementation process 【Benefits of Introduction】 - Cost reduction by replacing HC sheets - Improved yield through stable thermal pressing - Enhanced product reliability

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Silicone rubber sheet for ACF bonding for smartphones

For high-density implementation of smartphones. Improved reliability with HC sheet alternatives.

In the smartphone industry, the miniaturization and enhancement of product functionality have progressed, making high-density mounting technology using ACF (Anisotropic Conductive Film) essential. In ACF mounting, uniform pressure and temperature management during thermal pressing are critical factors that influence the reliability of the bonding. Improper pressing can lead to poor conductivity and early product failure. Our ACF thermal pressing silicone rubber sheet serves as a substitute for HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation and longevity of smartphones. 【Application Scene】 - Thermal pressing in ACF mounting processes 【Benefits of Introduction】 - Cost reduction by substituting HC sheets - Improved yield through stable thermal pressing - Enhanced product reliability

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Silicone rubber sheet for ACF bonding for wearables

Contributing to the miniaturization and reliability improvement of wearable devices.

In the field of wearable devices, miniaturization and high functionality of products are essential, and implementation technology using ACF (Anisotropic Conductive Film) is important. In ACF implementation, uniform pressure and temperature management during thermal pressing are critical factors that affect the reliability of the device. Improper pressing can lead to poor conductivity and early product failure. Our ACF thermal pressing silicone rubber sheet serves as an alternative to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation and longevity of wearable devices. [Usage Scenarios] - Thermal pressing in the ACF implementation process of wearable devices [Effects of Introduction] - Cost reduction by replacing HC sheets - Improved yield due to stable thermal pressing - Enhanced product reliability

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Silicone rubber sheet for ACF crimping for IoT devices

Contributing to power saving and improved reliability through ACF implementation in IoT devices.

In the IoT device industry, there is a demand for extended battery life and miniaturization of devices. Implementation technology using Anisotropic Conductive Film (ACF) is essential to meet these requirements. In ACF implementation, uniform pressure and temperature management during thermal pressing are crucial for the reliability of the bonding, which in turn affects the power consumption of the device. Improper pressing can lead to increased power consumption due to poor conductivity and potential early product failure. Our ACF thermal pressing silicone rubber sheets serve as an alternative to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation and longevity of IoT devices, ultimately leading to energy savings. [Usage Scenarios] - Thermal pressing in ACF implementation processes [Benefits of Implementation] - Cost reduction by replacing HC sheets - Improved yield due to stable thermal pressing - Enhanced product reliability - Contribution to energy savings

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Silicone rubber sheet for automotive ACF and hot pressing

Silicone for ACF crimping that contributes to vibration damping measures in automobiles.

In the automotive industry, it is essential to reduce vibrations and noise during driving to provide a comfortable ride. Particularly in areas where electronic components and precision devices are installed, vibration control measures are crucial to prevent failures and performance degradation caused by vibrations. The silicone rubber sheets used for ACF (Anisotropic Conductive Film) mounting address these challenges by offering high cushioning properties and durability. This product is also ideal as a substitute for HC sheets, achieving thermal conductivity, cushioning performance, and durability during ACF thermal bonding. 【Application Scenarios】 - Vibration control for automotive electronic devices - Vibration control in the engine compartment - Vibration control for interior trim components 【Benefits of Implementation】 - Reduced risk of component failure due to vibrations - Improved ride comfort - Enhanced product reliability

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Silicone rubber sheet for ACF and heat bonding for medical devices

Silicone rubber sheet to improve the sealing of medical devices.

In the medical device industry, high sealing performance is required to ensure the reliability and safety of products. In particular, preventing the intrusion of foreign substances and liquids from the outside is essential for maintaining the performance of the equipment and ensuring patient safety. Inadequate sealing can lead to equipment failure or malfunction. Our ACF thermal adhesive silicone rubber sheets have thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF bonding, contributing to enhanced sealing performance in medical devices. 【Application Scenarios】 - Sealing of medical electronic device enclosures - Sealing of inspection equipment - Protection of surgical instruments 【Benefits of Implementation】 - Improved product reliability due to high sealing performance - Prevention of foreign substance intrusion and liquid ingress - Extended lifespan of equipment - Assurance of patient safety

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Silicone rubber sheet for ACF bonding for displays

Ideal for replacing HC sheets with thinner displays and ACF implementation.

In the display industry, the trend towards thinner products has made implementation technology using ACF (Anisotropic Conductive Film) essential. In ACF implementation, uniform pressure and temperature management during thermal pressing are crucial factors that affect the reliability of the bonding. Improper pressing can lead to poor conductivity and early product failure. Our ACF thermal pressing silicone rubber sheets serve as alternatives to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to stable operation and longer lifespan of displays. 【Application Scenarios】 - Thermal pressing in ACF implementation processes 【Benefits of Introduction】 - Cost reduction by replacing HC sheets - Improved yield through stable thermal pressing - Enhanced product reliability

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Silicone rubber sheet for ACF bonding in aerospace applications

An ACF implementation that balances lightweight design and reliability. Ideal as a substitute for HC sheets.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. The implementation technology using Anisotropic Conductive Film (ACF) contributes to the miniaturization of electronic devices, but the management of pressure and temperature during thermal pressing affects the reliability of the bonding. Improper pressing can lead to poor conductivity and early failure in environments with severe vibrations and temperature changes. Our ACF thermal pressing silicone rubber sheets serve as alternatives to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation and longevity of aerospace equipment. 【Application Scenarios】 - Thermal pressing in ACF mounting processes 【Benefits of Implementation】 - Weight reduction and cost savings by replacing HC sheets - Improved yield through stable thermal pressing - Enhanced product reliability

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Silicone rubber sheet for ACF bonding in semiconductor manufacturing

Contributed to improving the yield of ACF implementation as an alternative to HC sheets.

In the semiconductor manufacturing industry, the miniaturization and enhancement of product functionality are advancing, making the implementation technology using ACF (Anisotropic Conductive Film) essential. In ACF implementation, uniform pressure and temperature management during thermal pressing are crucial factors that influence the reliability of the bonding. Improper pressing can lead to poor conductivity and early product failure, potentially reducing yield. Our ACF thermal pressing silicone rubber sheet serves as an alternative to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation of semiconductor products and improved yield. 【Application Scene】 - Thermal pressing in the ACF implementation process 【Effects of Introduction】 - Cost reduction by replacing HC sheets - Improved yield through stable thermal pressing - Enhanced product reliability

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