Ito Corporation Product Lineup

Supports everything from user-friendly standalone types to inline systems.

We accommodate everything from tabletop manual devices to fully automatic machines.

User-friendly standalone type

This is a direct plasma device that uses inert argon as the carrier gas. By directly irradiating the plasma onto the substrate with stable glow discharge, powerful modification can be achieved. It excels in cost performance due to low power consumption and low gas usage. Since the generation of ozone and nitrogen oxides is extremely low, exhaust equipment is not required.

This is a plasma unit that uses only 3L/min of argon gas for every 100mm of head length, making it highly cost-effective. It operates at low power and generates stable glow plasma. The generation of ozone and nitrogen oxides is also very low, so exhaust equipment is not required. Its very lightweight and simple structure allows for easy installation in your production equipment. It is available in widths ranging from 60mm to 2500mm. By connecting to the I/O port of the control box, automatic operation with the main equipment is also possible.

This is a bar-type atmospheric pressure plasma unit using N2. It can maintain a distance of up to approximately 8mm for irradiation, allowing plasma treatment of curved or uneven workpieces. Additionally, due to its low temperature, there is no thermal damage to the workpieces. 【Features】 ■ Capable of irradiation on curved and uneven workpieces ■ Can maintain a distance of up to approximately 8mm for irradiation ■ No thermal damage to workpieces due to low temperature *For more details, please request documentation or view the PDF data available for download.

The "MyPL Series" is an atmospheric pressure direct plasma device that uses argon gas. It is a simple tabletop model with a front-and-back sliding stage, making it suitable for research and development purposes, such as the modification of small-sized samples. Even for warped films, it can be fixed using an air suction stage, allowing for the treatment of the sample surface. 【Features】 ■ Equipped with a moving stage ■ Suitable for the modification of small-sized samples ■ Modification time can be set ■ Compatible with warped films *For more details, please refer to the PDF document or feel free to contact us.

The "ILP Series" is a standalone type device equipped with a direct plasma head using argon gas and a transport system with either a conveyor or a front-and-back sliding stage. It automatically controls the gas ON/OFF, plasma ON/OFF, and transport system ON/OFF through PLC control, making it suitable for use as a mass production facility for single sheets. The "ILP-S Series" features a front-and-back sliding stage type, while the "ILP-C Series" is a conveyor type. 【Features】 ■ Standalone type ■ Uses argon gas * For more details, please refer to the PDF materials or feel free to contact us. * An English version of the catalog is available for download.

This is an atmospheric pressure bonding device compatible with curved panels for smartphones, automotive applications, wearables, etc. It bonds OCA and film sensors to curved cover panels. ● Features (DH-10FAP) Compatible with curved panels / Bonds OCA and film sensors / Voltage: Single-phase 200V 20A 50/60Hz / Uses vacuum pump ● Functional Configuration (DH-10FAP) Upper stage: Size 350mm × 300mm / Material: Aluminum (MIC6) / Inversion section: Operates 180 degrees with a servo motor Lower stage: Size 300mm × 300mm / Material: Aluminum (MIC6) / Flatness: ±0.05mm Roller section: Size φ10mm × 297mm / Conductivity coefficient 10^9 Alignment section: Drive method: Mitsubishi servo motor / Alignment movable range: ±7mm *For more details, please refer to the PDF document or feel free to contact us.

The large laminating machine is designed for processes involving film/film, film/film/glass, and film/film/plastic sheet. It automatically aligns and laminates OCA or glass and sensors using precision image processing and a unique atmospheric roller mechanism. ● Functional Configuration Upper Stage: Size 600–850mm × 530–850mm / Material Aluminum (MIC6) / Inversion Section operates 180 degrees via a rotating cylinder Lower Stage: Size 500–850mm × 500–850mm / Material Aluminum (MIC6) / Flatness ±0.05mm / Temperature Setting Range 40℃–70℃ (±5℃) Roller Section: Size φ30–40mm × 530–860mm / Conductivity 10^9 Alignment Section: Drive Method Mitsubishi Servo Motor / Alignment Movement Range ±15mm *For more details, please refer to the PDF document or feel free to contact us.

The vacuum laminating machine is a device that performs lamination of touch panels and LCD modules ranging from 2.8 inches to 15 inches. The LCM is placed on the lower layer of the jig, and after the operator removes the OCM protective film, the touch panel is placed back on the upper layer of the jig. When the equipment reaches a vacuum, the touch panel and LCM are laminated together. ● Machine Configuration (DH-12GVP15M-A) Lower Stage: Two units (one on the left and one on the right) Movement Method: Moves left and right using cylinders Stage Size: 540mm x 540mm Positioning: Position is determined by the jig *For more details, please refer to the PDF document or feel free to contact us.

We offer a variety of "lamination devices" that are active in the manufacturing processes of touch panels and LCD panels. 【Product Lineup】 < Vacuum Lamination Device > ■ For laminating touch panels and LCD panel modules ■ 2-stage specification ■ Positioning with jigs ■ Lamination accuracy: ±0.1mm (excluding material accuracy) < Large Lamination Device > ■ For the manufacturing process of touch panels ■ Automatic alignment lamination possible with precision image processing ■ Equipped with a unique atmospheric roller mechanism ■ Lamination accuracy: ±0.05mm (excluding material accuracy) < Curved Lamination Device > ■ For laminating films and glass of touch panel products ■ Equipped with a high-performance image system and two 5-megapixel CCD cameras ■ Supports both curved and flat lamination with jig changes ■ Lamination accuracy: ±0.1mm (excluding material accuracy) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

We would like to introduce our "Tabletop / Standalone Atmospheric Pressure Plasma Devices." Starting with the simple tabletop atmospheric pressure plasma device "MyPL series," we also offer the standalone "ILP series," direct plasma devices using inert argon as the carrier gas, and the atmospheric pressure plasma head unit "MD series" that utilizes argon gas. Additionally, we provide a bar-type atmospheric pressure plasma unit using N2, which can irradiate curved and uneven workpieces. 【Product Lineup】 ■ Tabletop Atmospheric Pressure Plasma Device "MyPL series" ■ Atmospheric Pressure Plasma Device "ILP series" ■ Direct Plasma Device ■ Atmospheric Pressure Plasma Head Unit "MD series" ■ Long-Distance Irradiation N2 Plasma Unit *For more details, please refer to the PDF materials or feel free to contact us.

This device is an "OCA/OCR rework machine" that can rework expensive panels, LCD modules, and more without causing damage. It is suitable for reworking combinations such as glass covers with touch panels and plastic covers with touch panels. 【Basic Specifications】 ■ Work Size: 280mm × 320mm ■ Panel Thickness: 25mm ■ Compatible OCA Thickness: 0.25mm to 2mm ■ Working Height: 900mm ± 50mm ■ Machine Weight: Approximately 800kg *For more details, please refer to the PDF document or feel free to contact us.

The "Vacuum Alignment Laminating Machine" is suitable for laminating cover glass with glass touch panels and cover glass with LCD modules. Thanks to its unique system, alignment marks, edges, and wiring can be easily registered. It is also compatible with curved cover glass. 【Features】 ■ Equipped with a unique imaging system ■ Very easy mark registration ■ Capable of high-precision lamination ■ Compatible with curved cover glass (with curvature constraints) *For more details, please refer to the PDF document or feel free to contact us.

This machine is a device for laminating films and touch panels onto large cover panels. It uses atmospheric pressure for roller lamination, which results in a short cycle time and is one of its features that contributes to high productivity. It is suitable for automotive interior panels and center consoles. 【Features】 ■ Compatible with large cover panels for automotive use ■ Roller lamination using atmospheric pressure ■ Short cycle time and very high productivity *For more details, please refer to the PDF document or feel free to contact us.

These are various types of gloves for glove boxes, including butyl, CSM, and EPDM.

Our company offers a variety of "lamination devices" that are utilized in the manufacturing processes of touch panels and LCD panels. We can accommodate complex shapes, such as curved surfaces and S-shaped cover glass, through the optical bonding process for automotive instrument panels and other curved applications. Additionally, we also handle AOI inspection devices and rework devices. *For more details, please download the PDF or contact us. 【Example of Product Lineup】 < Vacuum Lamination Device > ■ For lamination of touch panels and LCD panel modules ■ Lamination accuracy: ±0.1mm (excluding material accuracy) < Large Lamination Device > ■ For the manufacturing process of touch panels ■ Lamination accuracy: ±0.05mm (excluding material accuracy) < Curved Lamination Device > ■ For lamination of films and glass in touch panel products ■ Lamination accuracy: ±0.1mm (excluding material accuracy)

"Advanced Visible Plasma" is a plasma cleaning device characterized by its compact head. It also features visualization, long-distance irradiation (up to 15mm), and low temperature, making it suitable for situations where a wide area needs to be processed at once. It can be used in applications such as module processes for electronic components, packaging processes for semiconductors, and bonding, coating, and cleaning of secondary batteries. 【Features】 ■ Compact head ■ Visualization ■ Long-distance irradiation (up to 15mm) ■ Low temperature *For more details, please refer to the PDF document or feel free to contact us.

"Non-contact, clean, and free." The Maglev transport system is a new transport technology that drives carriers (transport carts) using magnetic force. It prevents the generation of wear dust and oil contamination by not using belts or chains. It can transport products at high speed and with high precision, achieving both cleanliness and efficiency in production sites. Additionally, the layout is completely flexible!

This product is ideal as a substitute for the discontinued Shin-Etsu Chemical HC sheets (HC-20MS, HC-30MS, HC-45MS). It has thermal conductivity (internal temperature of ACF), cushioning performance, and durability equivalent to that of HC sheets during ACF thermal bonding. Depending on specifications such as thickness and width, we can accommodate orders starting from approximately 10 reels in small quantities.

The ILT-2000 enables processing at low temperatures that could not be achieved with conventional air plasma. It allows for optimal performance while keeping the surface temperature low. - Does not want to use gas. - The plasma treatment area is small. - Does not want to affect the substrate with heat. It is ideal for customers.

The AVP series uses N2 and air to create atmospheric pressure plasma. Since the plasma is directly irradiated onto the substrate, it provides strong modification power. Additionally, due to the minimal thermal impact, it is also possible to process substrates that are sensitive to heat. There are both bar-type and spot-type options available, allowing for nozzle designs tailored to the shape of the customer's substrate (with some restrictions).

In the electronics industry, as products become smaller and more high-performance, it is important to protect the internal precision components from shocks and vibrations. Particularly in electronic devices with ACF (Anisotropic Conductive Film) implementation, the pressure during thermal pressing and external shocks greatly affect the product's reliability. Our silicone rubber sheets for ACF thermal pressing serve as an alternative to HC sheets (HC-20MS, HC-30MS, HC-45MS), providing equivalent thermal conductivity (internal temperature of ACF), cushioning performance, and durability during ACF thermal pressing. 【Application Scenarios】 - Precision instruments - FPD (Flat Panel Display) - Electronic components requiring ACF implementation 【Benefits of Implementation】 - Alternative to HC sheets - Compatibility with various sizes - Orders accepted from small quantities

Our ACF thermal bonding silicone rubber sheet serves as an alternative to HC sheets, achieving thermal conductivity, cushioning performance, and durability during ACF thermal bonding. 【Application Scenarios】 - ACF mounting process for displays - Replacement for HC sheets 【Benefits of Implementation】 - Improved reliability of ACF mounting - Potential cost reduction

In the precision machinery industry, the miniaturization and enhancement of product functionality are advancing, making ACF (Anisotropic Conductive Film) implementation technology essential. In ACF implementation, uniform pressure and temperature management during thermal pressing are crucial factors that influence the reliability of the bonding. Improper pressing can lead to poor conductivity and early product failure. Our ACF thermal pressing silicone rubber sheets serve as alternatives to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation and longevity of precision machinery. 【Application Scenarios】 - Thermal pressing in the ACF implementation process 【Benefits of Introduction】 - Cost reduction by replacing HC sheets - Improved yield through stable thermal pressing - Enhanced product reliability

In the smartphone industry, the miniaturization and enhancement of product functionality have progressed, making high-density mounting technology using ACF (Anisotropic Conductive Film) essential. In ACF mounting, uniform pressure and temperature management during thermal pressing are critical factors that influence the reliability of the bonding. Improper pressing can lead to poor conductivity and early product failure. Our ACF thermal pressing silicone rubber sheet serves as a substitute for HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation and longevity of smartphones. 【Application Scene】 - Thermal pressing in ACF mounting processes 【Benefits of Introduction】 - Cost reduction by substituting HC sheets - Improved yield through stable thermal pressing - Enhanced product reliability

In the field of wearable devices, miniaturization and high functionality of products are essential, and implementation technology using ACF (Anisotropic Conductive Film) is important. In ACF implementation, uniform pressure and temperature management during thermal pressing are critical factors that affect the reliability of the device. Improper pressing can lead to poor conductivity and early product failure. Our ACF thermal pressing silicone rubber sheet serves as an alternative to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation and longevity of wearable devices. [Usage Scenarios] - Thermal pressing in the ACF implementation process of wearable devices [Effects of Introduction] - Cost reduction by replacing HC sheets - Improved yield due to stable thermal pressing - Enhanced product reliability

In the IoT device industry, there is a demand for extended battery life and miniaturization of devices. Implementation technology using Anisotropic Conductive Film (ACF) is essential to meet these requirements. In ACF implementation, uniform pressure and temperature management during thermal pressing are crucial for the reliability of the bonding, which in turn affects the power consumption of the device. Improper pressing can lead to increased power consumption due to poor conductivity and potential early product failure. Our ACF thermal pressing silicone rubber sheets serve as an alternative to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation and longevity of IoT devices, ultimately leading to energy savings. [Usage Scenarios] - Thermal pressing in ACF implementation processes [Benefits of Implementation] - Cost reduction by replacing HC sheets - Improved yield due to stable thermal pressing - Enhanced product reliability - Contribution to energy savings

In the automotive industry, it is essential to reduce vibrations and noise during driving to provide a comfortable ride. Particularly in areas where electronic components and precision devices are installed, vibration control measures are crucial to prevent failures and performance degradation caused by vibrations. The silicone rubber sheets used for ACF (Anisotropic Conductive Film) mounting address these challenges by offering high cushioning properties and durability. This product is also ideal as a substitute for HC sheets, achieving thermal conductivity, cushioning performance, and durability during ACF thermal bonding. 【Application Scenarios】 - Vibration control for automotive electronic devices - Vibration control in the engine compartment - Vibration control for interior trim components 【Benefits of Implementation】 - Reduced risk of component failure due to vibrations - Improved ride comfort - Enhanced product reliability

In the medical device industry, high sealing performance is required to ensure the reliability and safety of products. In particular, preventing the intrusion of foreign substances and liquids from the outside is essential for maintaining the performance of the equipment and ensuring patient safety. Inadequate sealing can lead to equipment failure or malfunction. Our ACF thermal adhesive silicone rubber sheets have thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF bonding, contributing to enhanced sealing performance in medical devices. 【Application Scenarios】 - Sealing of medical electronic device enclosures - Sealing of inspection equipment - Protection of surgical instruments 【Benefits of Implementation】 - Improved product reliability due to high sealing performance - Prevention of foreign substance intrusion and liquid ingress - Extended lifespan of equipment - Assurance of patient safety

In the display industry, the trend towards thinner products has made implementation technology using ACF (Anisotropic Conductive Film) essential. In ACF implementation, uniform pressure and temperature management during thermal pressing are crucial factors that affect the reliability of the bonding. Improper pressing can lead to poor conductivity and early product failure. Our ACF thermal pressing silicone rubber sheets serve as alternatives to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to stable operation and longer lifespan of displays. 【Application Scenarios】 - Thermal pressing in ACF implementation processes 【Benefits of Introduction】 - Cost reduction by replacing HC sheets - Improved yield through stable thermal pressing - Enhanced product reliability

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. The implementation technology using Anisotropic Conductive Film (ACF) contributes to the miniaturization of electronic devices, but the management of pressure and temperature during thermal pressing affects the reliability of the bonding. Improper pressing can lead to poor conductivity and early failure in environments with severe vibrations and temperature changes. Our ACF thermal pressing silicone rubber sheets serve as alternatives to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation and longevity of aerospace equipment. 【Application Scenarios】 - Thermal pressing in ACF mounting processes 【Benefits of Implementation】 - Weight reduction and cost savings by replacing HC sheets - Improved yield through stable thermal pressing - Enhanced product reliability

In the semiconductor manufacturing industry, the miniaturization and enhancement of product functionality are advancing, making the implementation technology using ACF (Anisotropic Conductive Film) essential. In ACF implementation, uniform pressure and temperature management during thermal pressing are crucial factors that influence the reliability of the bonding. Improper pressing can lead to poor conductivity and early product failure, potentially reducing yield. Our ACF thermal pressing silicone rubber sheet serves as an alternative to HC sheets (HC-20MS, HC-30MS, HC-45MS), achieving thermal conductivity, cushioning performance, and durability equivalent to HC sheets during ACF thermal pressing. This contributes to the stable operation of semiconductor products and improved yield. 【Application Scene】 - Thermal pressing in the ACF implementation process 【Effects of Introduction】 - Cost reduction by replacing HC sheets - Improved yield through stable thermal pressing - Enhanced product reliability