芳賀精密工業 List of Products and Services

The "SB0S-2000H" is a three-stage, two-head type automatic resin coating device. It was developed for resin encapsulation applications in COB (Chip On Board), but it can also be repurposed for various applications as it can draw two types of resin in free trajectories. Additionally, since it has an intermediate stage, it can be used for processes such as semi-curing to curing of the resin. (Currently, it only supports thermal curing; UV curing and other options are available upon consultation.) 【Features】 ■ Adjustable based on thermal curing properties and fluidity ■ The coating trajectory can pass through coordinates set in the program, allowing for irregular drawing ■ Height sensors enable inspection for exceeding upper and lower limits of height reference values *For more details, please download the PDF or feel free to contact us.

• Other mounting machines

As part of the processing steps for electronic devices utilizing ICs that our company conducts, we follow the procedures below: ○ Die bonding ←→ Adhesion of IC to substrate ○ Wire bonding ←→ Connection between substrate and IC using gold wire ○ Wire inspection ←→ Inspection of bonding errors and loop shape ○ Encapsulation potting ←→ Protection of IC and gold wire ○ Electrical characteristic inspection ←→ After soldering or after assembly ○ Soldering ←→ Soldering by reflow, dipping, or hand soldering ○ Thermal compression bonding ←→ Heat sealing, connection of flex ○ Assembly ←→ Various types of assembly ○ Packaging In each step of the process, we always tailor the selection of materials, plating thickness, types of equipment, and appearance standards to meet our customers' needs.

• Dedicated IC