Bonda - Company Ranking(24 companies in total)
Last Updated: Aggregation Period:Sep 17, 2025〜Oct 14, 2025
This ranking is based on the number of page views on our site.
Display Company Information
Company Name | Featured Products | ||
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Product Image, Product Name, Price Range | overview | Application/Performance example | |
Described in the catalog materials. | Usage: MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP Examples of achievements: Please... | ||
ASM's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can pr... | We have a wealth of experience in various applications such as LED-related, Opto solutions, and sensor-related fields. | ||
ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can ... | MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP, MTP etc. | ||
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- Featured Products
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ASMPT's ultra-high precision flip chip bonder 'NANO'
- overview
- Described in the catalog materials.
- Application/Performance example
- Usage: MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP Examples of achievements: Please...
ASMPT AD830Plus Epoxy Die Bonder
- overview
- ASM's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can pr...
- Application/Performance example
- We have a wealth of experience in various applications such as LED-related, Opto solutions, and sensor-related fields.
ASMPT's ultra-high precision flip chip bonder 'NANO Pro'
- overview
- ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can ...
- Application/Performance example
- MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP, MTP etc.
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