Bonda - Company Ranking(20 companies in total)
Last Updated： Aggregation Period:Aug 12, 2026〜Sep 08, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| [About ASMPT's Flip Chip/Die Bonder] We offer a lineup of products with alignment accuracy ranging from 0.2μm to 25μm and cycle times from... | Various packages and applications such as QFN, BGA, MEMS, SiP, thin chips, and large dies. | ||
| 【Other Features】 ■ Z-axis operation and bond load are computer-controlled, eliminating differences in bondability due to the operator. ■ Eas... | Since its founding, MPP has over 40 years of experience and know-how, and is used in a wide range of fields including microelectronics, medi... | ||
| Described in the catalog materials. | Applications: Semiconductor advanced packaging, MEMS, Automotive Sensors, RFID, LED, Optoelectronic | ||
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- Featured Products
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ASMPT's epoxy die bonder "INFINITE" <New Release>
- overview
- [About ASMPT's Flip Chip/Die Bonder] We offer a lineup of products with alignment accuracy ranging from 0.2μm to 25μm and cycle times from...
- Application/Performance example
- Various packages and applications such as QFN, BGA, MEMS, SiP, thin chips, and large dies.
MPP Corporation's "Manual Wire Bonder iBond5000 Series"
- overview
- 【Other Features】 ■ Z-axis operation and bond load are computer-controlled, eliminating differences in bondability due to the operator. ■ Eas...
- Application/Performance example
- Since its founding, MPP has over 40 years of experience and know-how, and is used in a wide range of fields including microelectronics, medi...
ASMPT manufactured flip chip bonder - Novaplus
- overview
- Described in the catalog materials.
- Application/Performance example
- Applications: Semiconductor advanced packaging, MEMS, Automotive Sensors, RFID, LED, Optoelectronic
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