Bonda - Company Ranking(20 companies in total)
Last Updated： Aggregation Period:May 06, 2026〜Jun 02, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Described in the catalog materials. | Usage: MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP Examples of achievements: Please... | ||
| ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can ... | LED-related items such as COB, CSP, phosphor film, and TOcan. | ||
| 【Other Features】 ■ Z-axis operation and bond load are computer-controlled, eliminating differences in bondability due to the operator. ■ Eas... | Since its founding, MPP has over 40 years of experience and know-how, and is used in a wide range of fields including microelectronics, medi... | ||
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- Featured Products
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ASMPT's ultra-high precision flip chip bonder 'NANO'
- overview
- Described in the catalog materials.
- Application/Performance example
- Usage: MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP Examples of achievements: Please...
ASMPT manufactured AD838L-G2 epoxy die bonder
- overview
- ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can ...
- Application/Performance example
- LED-related items such as COB, CSP, phosphor film, and TOcan.
MPP Corporation's "Manual Wire Bonder iBond5000 Series"
- overview
- 【Other Features】 ■ Z-axis operation and bond load are computer-controlled, eliminating differences in bondability due to the operator. ■ Eas...
- Application/Performance example
- Since its founding, MPP has over 40 years of experience and know-how, and is used in a wide range of fields including microelectronics, medi...
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