Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.
The "Manual Wire Bonder iBond5000 Series" is a successor to the "4500 Series," which boasts over 400 units delivered domestically. (The 5000 Series has over 9,000 units delivered worldwide.) Bonding can be easily performed with just a click of the mouse. Its compact size makes it suitable for research and development as well as small-scale production. You can choose from three models: "for Ball Bonding," "for Wedge Bonding," and "for Both Ball and Wedge Bonding." 【Features】 ■ Equipped with a user-friendly touch panel ■ Y-axis table motion settings can be configured with parameters, making bonding of pitch wires and parallel wires easy ■ Ergonomically designed ■ ESD coating is standard *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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【Other Features】 ■ Z-axis operation and bond load are computer-controlled, eliminating differences in bondability due to the operator. ■ Easy adjustment of bonding parameters. ■ Import and export of parameters using USB is possible. ■ By using the same components as MPP's automatic machines, it combines the ease of manual machines with the high reliability of automatic machines. 【Bonding Types & Compatible Wire Types】 ＜iBond5000 Ball＞ Bonding Type: Bumping, Coining, Security Bond, Tab Compatible Wire Types: Gold wire, Copper wire (Cu kit option) ＜iBond5000 Wedge＞ Bonding Type: Wedge, Tab, Stitch, Ribbon Compatible Wire Types: Aluminum wire, Gold wire, Ribbon, and Copper wire ＜iBond5000 Dual＞ Bonding Type: Wedge, Tab, Stitch, Ribbon, Bump, Ball Coining, Security Bond Compatible Wire Types: Gold wire, Copper wire (Wedge Ball), Aluminum wire, Ribbon (Gold, Copper)
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Since its founding, MPP has over 40 years of experience and know-how, and is used in a wide range of fields including microelectronics, medical, military, and aerospace, supplying products to over 400 customers in 20 countries.
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Company information
Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.