We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Mounter.
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Mounter - Company Ranking(16 companyies in total)

Last Updated: Aggregation Period:Jul 23, 2025〜Aug 19, 2025
This ranking is based on the number of page views on our site.

Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
This laminator accommodates wafers from 4 inches to 8 inches, features a compact design that can be placed on a tabletop, and is user-friendly enough for beginners to operate. Skilled operators are not required for the operation of the MW-150 model. Additionally, it comes standard with an automatic sheet cutting device, further enhancing work efficiency. A semi-automatic MW300S model is also available. For other functions and details, please contact us or download the catalog. (Contact: Kawaguchi)  -
A device for semi-automatically applying dicing tape to silicon wafers. It is a semi-auto type compatible with 8/12-inch wafers, and the supply of the wafer frame and the removal of the frame mount are manual. ■ For other functions and details, please contact us or download the catalog. (Contact: Kawaguchi) The dicing tape is applied semi-automatically to the Si wafer.
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  1. Featured Products
    Dicing tape mountDicing tape mount
    overview
    This laminator accommodates wafers from 4 inches to 8 inches, features a compact design that can be placed on a tabletop, and is user-friendly enough for beginners to operate. Skilled operators are not required for the operation of the MW-150 model. Additionally, it comes standard with an automatic sheet cutting device, further enhancing work efficiency. A semi-automatic MW300S model is also available. For other functions and details, please contact us or download the catalog. (Contact: Kawaguchi)
    Application/Performance example
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    Dicing Tape Mount (Semi-Automatic Type)Dicing Tape Mount (Semi-Automatic Type)
    overview
    A device for semi-automatically applying dicing tape to silicon wafers. It is a semi-auto type compatible with 8/12-inch wafers, and the supply of the wafer frame and the removal of the frame mount are manual. ■ For other functions and details, please contact us or download the catalog. (Contact: Kawaguchi)
    Application/Performance example
    The dicing tape is applied semi-automatically to the Si wafer.