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  5. Other semiconductor manufacturing equipment
  6. Film Attachment Device | Manual Mounting Machine FM-224 Series

Film Attachment Device | Manual Mounting Machine FM-224 Series

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FM-224 series

last updated:May 09, 2023

TECHNOVISION, INC. main office
TECHNOVISION, INC. main office
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Starting with research and development, a wide range of equipment selection is possible according to the purpose, up to semi-production applications.

The wafer mount / tape mount is a tape application device that instantly adheres "wafers," "dicing frames," and various films/tapes without bubbles. It allows for the easy application of uniform tape to wafers, which is considered important in the dicing process. TechnoVision's wafer mount offers a wide range of equipment options tailored to various purposes, from research and development to semi-production applications. The manual type wafer mount is available in three work sizes: - 300mm (12 inches) - 200mm (8 inches) - 150mm (6 inches) (Free demo units are also available for loan.) Additionally, there are devices with specifications tailored for specific applications, such as dicing and back grinding. The application targets are not limited to wafers; the device can accommodate various workpieces such as packages, glass, ceramics, and more. Custom solutions can also be flexibly provided to meet users' special specifications.

    Wafer processing/polishing equipmentOther semiconductor manufacturing equipmentMounter
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Film Attachment Device | Manual Mounting Machine FM-224 Series

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224.jpg
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basic information

■Main Features - Instant bubble-free application. - Built-in automatic balance mechanism for the application roller. - Built-in circumferential cutter. - Built-in horizontal cutter. - Built-in separator winding mechanism. - Options: Heater unit, damper, electrostatic measures.

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Applications/Examples of results

【Dicing Applications】 After wafer dicing by a dicer, dicing tape is applied to the back side to hold the wafer being cut during dicing, preventing the chips from falling apart. 【Protection (Back Grind/BG) Applications】 When performing back grinding on the back side of the wafer for thinning purposes, protective tape is applied to protect the circuits on the surface. 【Others】 Other roll-type films can be accommodated with film attachment (such as DAF attachment, resist film attachment, etc.).

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Model number overview
FM-2243 Up to 12 inches | Device size: 510mm (W) x 860mm (D) x 330mm (H)
FM-2248 Up to 8 inches | Device size: 455mm (W) x 780mm (D) x 300mm (H)
FM-2246 Up to 6 inches | Device size: 375mm (W) x 760mm (D) x 230mm (H)
FM-2243-BG Up to 12 inches Back grind: 300mm/12, device compatible with BG applications
FM-2248-BG Up to 8 inches Back grind: 200mm/8, device compatible with BG applications
FM-2246-BG Up to 6 inches Back grind: 150mm/6, device compatible with BG applications

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TechnoVision | Comprehensive Product Catalog

TechnoVision | Comprehensive Product Catalog

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Wafer/Film Attachment Device | Wafer Mounter

Wafer/Film Attachment Device | Wafer Mounter

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Company information

TECHNOVISION,

TECHNOVISION, INC. main office

Electronic Components and Semiconductors

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Techno Vision Co., Ltd. has been engaged in the development, manufacturing, and import/export of its own products, focusing on cleaning technology and assembly technology since its establishment in September 1987. In today's high-tech industry, we are committed to responding to our customers' needs and providing technology, products, and services from the perspective of our customers.

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