bonding - Company Ranking(7 companies in total)
Last Updated： Aggregation Period:Apr 08, 2026〜May 05, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
Wire bonding
Other |
Corresponding specifications - Components: Minimum pad 60 microns, pitch 80 microns - PCB: Minimum pad 100 microns, pitch 150 microns ... | Semiconductor substrates, module substrates, flexible substrates | |
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ピーダブルビー 草津事業所
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- Featured Products
-
Wire bonding
- overview
- Corresponding specifications - Components: Minimum pad 60 microns, pitch 80 microns - PCB: Minimum pad 100 microns, pitch 150 microns ...
- Application/Performance example
- Semiconductor substrates, module substrates, flexible substrates
-
ピーダブルビー 草津事業所
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