A technology for connecting electrodes of printed circuit boards and semiconductor packages using wires.
We will propose work methods tailored to the shape and use of the parts. We can also accommodate work starting from just one piece.
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basic information
Corresponding specifications - Components: Minimum pad 60 microns, pitch 80 microns - PCB: Minimum pad 100 microns, pitch 150 microns - Wire: Gold, aluminum, copper - PCB size: 100mm x 200mm - Resin encapsulation: Possible
Price range
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Applications/Examples of results
Semiconductor substrates, module substrates, flexible substrates
Company information
P-Dub-B Co., Ltd. has been expanding its business areas related to printed circuit boards since its establishment in 1978, and now has built a consistent production system (ADAMS) that handles everything in-house, from software and hardware design to manufacturing and assembly. We flexibly respond to our customers' increasingly diverse and sophisticated needs.
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