Ceramic Package - Company Ranking(4 companies in total)
Last Updated： Aggregation Period:Feb 25, 2026〜Mar 24, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| We have developed a millimeter-wave and microwave package that combines an MIC substrate with a micro-blasting processed ceramic cap. | 1) A multi-chip package capable of integrating multiple MMICs. 2) The development period can be shortened to one-fifth of that of conventi... | ||
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東洋精密工業
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- Featured Products
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MIC substrate integrated ceramic package
- overview
- We have developed a millimeter-wave and microwave package that combines an MIC substrate with a micro-blasting processed ceramic cap.
- Application/Performance example
- 1) A multi-chip package capable of integrating multiple MMICs. 2) The development period can be shortened to one-fifth of that of conventi...
-
東洋精密工業
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