Chuck - Company Ranking(4 companyies in total)
Last Updated： Aggregation Period:Jul 09, 2025〜Aug 05, 2025
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| Company Name | Featured Products | ||
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| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Other Features】 ■ Operates on 100V power with approximately 40W ■ Eliminates irradiation unevenness and improves inspection accuracy ■ Easy attachment and detachment of workpieces ■ Reduces labor hours *For more details, please refer to the PDF document or feel free to contact us. | 【Applications】 ■ Internal pattern inspection of multilayer wafers ■ Inspection of substrate edges and through holes ■ Other image inspections *For more details, please refer to the PDF document or feel free to contact us. | ||
| This is a large-diameter porous chuck compatible with 300mm wafers. We have also completed prototypes of even larger diameters and are working on compatibility with next-generation large-diameter wafers. | 【Examples of Use】 ■ Semiconductor manufacturing equipment ■ Various semiconductor inspection and measurement equipment ■ FPD manufacturing equipment, transport equipment ■ Image analysis equipment, various drawing devices, optical microscopes ■ Lithium-ion batteries ■ Medical devices ■ Printing transport and coating, etc. *For more details, please refer to the PDF document or feel free to contact us. | ||
| 【Capabilities】 ○ Heating up to 250°C on the porous surface is possible ○ Cooling (air cooling or water cooling) is also possible, in addition to heating ○ Heating can be done while maintaining adsorption ● For more details, please contact us or download the catalog. | 【Applications】 ○ Electrical durability testing of heated wafers ○ Semiconductor manufacturing processes in a vacuum ○ Wafer-level bonding ○ Wafer bonding technology using thermal curing ● For more details, please contact us or download the catalog. | ||
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吉岡精工
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- Featured Products
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Chuck "Surface-emitting Porous Chuck"
- overview
- 【Other Features】 ■ Operates on 100V power with approximately 40W ■ Eliminates irradiation unevenness and improves inspection accuracy ■ Easy attachment and detachment of workpieces ■ Reduces labor hours *For more details, please refer to the PDF document or feel free to contact us.
- Application/Performance example
- 【Applications】 ■ Internal pattern inspection of multilayer wafers ■ Inspection of substrate edges and through holes ■ Other image inspections *For more details, please refer to the PDF document or feel free to contact us.
Chuck "12-Inch Porous Chuck"
- overview
- This is a large-diameter porous chuck compatible with 300mm wafers. We have also completed prototypes of even larger diameters and are working on compatibility with next-generation large-diameter wafers.
- Application/Performance example
- 【Examples of Use】 ■ Semiconductor manufacturing equipment ■ Various semiconductor inspection and measurement equipment ■ FPD manufacturing equipment, transport equipment ■ Image analysis equipment, various drawing devices, optical microscopes ■ Lithium-ion batteries ■ Medical devices ■ Printing transport and coating, etc. *For more details, please refer to the PDF document or feel free to contact us.
Chuck "Hot Vacuum Chuck (HoVaC)"
- overview
- 【Capabilities】 ○ Heating up to 250°C on the porous surface is possible ○ Cooling (air cooling or water cooling) is also possible, in addition to heating ○ Heating can be done while maintaining adsorption ● For more details, please contact us or download the catalog.
- Application/Performance example
- 【Applications】 ○ Electrical durability testing of heated wafers ○ Semiconductor manufacturing processes in a vacuum ○ Wafer-level bonding ○ Wafer bonding technology using thermal curing ● For more details, please contact us or download the catalog.
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吉岡精工
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