Equipment development services - Company Ranking(42 companyies in total)

Last Updated：Sep 17, 2025 Aggregation Period:Aug 20, 2025〜Sep 16, 2025
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Company Name	Company information	Featured Products
Company Name	Company information	Product Image, Product Name, Price Range	overview	Application/Performance example
カイジョー ODM事業部	Address Tokyo/ number of employees 272 Business Activities The following is a technical introduction to our ODM business. For information on other businesses and products, please visit https://www.kaijo.co.jp/. [Product Development Applications] - Ultrasonic oscillation and control technology that covers a wide range from low frequency (kHz) to high frequency (MHz) - Power control technology in units of 0.1W - Design and manufacturing technology for various transducers, including probes, sensors, and the aggregation (standing wave control), cutting, welding, and atomization of particles and cells - An auto-matching oscillator that resolves issues by only replacing parts on the transducer side in the event of a failure - Cavitation generation and control technology using ultrasound (microbubbles and nanobubbles) [Manufacturing Applications] - Adhesion, wiring, and molding technology for ultrasonic transducers with a wide variety of materials - Ultrasonic evaluation technology for probe quality factors such as BNR, ERA, and sound pressure - Dissimilar metal bonding technology including Au, Ag, Pt, and Al - Technology for wiring (adhesion) ultra-fine wires with micron diameters in extremely small areas - High-speed bonding technology on the order of tens of milliseconds and the technology to control it Key Partners	Semiconductor assembly equipment Wire Bonder FB-900 Other	【Features】 ○ Vibration-damping control XY stage that achieves low vibration ○ Ultra-compact recoil-free cut clamp ○ High-speed bonding head that realizes low inertia ○ Equipped with dual-frequency ultrasonic transducer ○ Supports wide area ○ Two-color LED lighting ○ Support functions for complex varieties ● For other functions and details, please download the catalog.	For more details, please contact us.
		Semiconductor assembly equipment Wire Bonder FB-780 Other	【Features】 ○ Ultra-fast bonding: 58 milliseconds/wire ○ Fine pitch compatible: 35μm ○ Various loop modes available ○ High variety compatibility 　Operable without part replacement for wire diameters of 15 to 75μm ○ New graphic user interface ● For other functions and details, please download the catalog.	For more details, please contact us.
		Wire Bonder - Fully Automatic Wire Bond Other	◆◇◆ Features ◆◇◆ ◆ High-speed bonding: 54 milliseconds/wire With loop control; wire length 0.5mm ◆ Pad opening compatibility: 35μm ◆ Equipped with various loop modes ◆ High variety compatibility: Operates without part replacement for gold wire diameters of 15 to 75μm ◆ New graphic user interface ◆ For other functions and details, please download the catalog or contact us.	For more details, please contact us.
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カイジョー ODM事業部

Address

Tokyo/

number of employees

272

Business Activities

The following is a technical introduction to our ODM business. For information on other businesses and products, please visit https://www.kaijo.co.jp/. [Product Development Applications] - Ultrasonic oscillation and control technology that covers a wide range from low frequency (kHz) to high frequency (MHz) - Power control technology in units of 0.1W - Design and manufacturing technology for various transducers, including probes, sensors, and the aggregation (standing wave control), cutting, welding, and atomization of particles and cells - An auto-matching oscillator that resolves issues by only replacing parts on the transducer side in the event of a failure - Cavitation generation and control technology using ultrasound (microbubbles and nanobubbles) [Manufacturing Applications] - Adhesion, wiring, and molding technology for ultrasonic transducers with a wide variety of materials - Ultrasonic evaluation technology for probe quality factors such as BNR, ERA, and sound pressure - Dissimilar metal bonding technology including Au, Ag, Pt, and Al - Technology for wiring (adhesion) ultra-fine wires with micron diameters in extremely small areas - High-speed bonding technology on the order of tens of milliseconds and the technology to control it

Key Partners

Featured Products

Semiconductor assembly equipment Wire Bonder FB-900

overview

【Features】 ○ Vibration-damping control XY stage that achieves low vibration ○ Ultra-compact recoil-free cut clamp ○ High-speed bonding head that realizes low inertia ○ Equipped with dual-frequency ultrasonic transducer ○ Supports wide area ○ Two-color LED lighting ○ Support functions for complex varieties ● For other functions and details, please download the catalog.

Application/Performance example

For more details, please contact us.

Semiconductor assembly equipment Wire Bonder FB-780

overview

【Features】 ○ Ultra-fast bonding: 58 milliseconds/wire ○ Fine pitch compatible: 35μm ○ Various loop modes available ○ High variety compatibility 　Operable without part replacement for wire diameters of 15 to 75μm ○ New graphic user interface ● For other functions and details, please download the catalog.

Application/Performance example

For more details, please contact us.

Wire Bonder - Fully Automatic Wire Bond

overview

◆◇◆ Features ◆◇◆ ◆ High-speed bonding: 54 milliseconds/wire With loop control; wire length 0.5mm ◆ Pad opening compatibility: 35μm ◆ Equipped with various loop modes ◆ High variety compatibility: Operates without part replacement for gold wire diameters of 15 to 75μm ◆ New graphic user interface ◆ For other functions and details, please download the catalog or contact us.

Application/Performance example

For more details, please contact us.
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Business Activities

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Equipment development services - Company Ranking(42 companyies in total)

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