Further evolved, speed and stability.
This is an introduction to semiconductor assembly equipment capable of supporting small-lot production of various types.
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basic information
【Features】 ○ Vibration-damping control XY stage that achieves low vibration ○ Ultra-compact recoil-free cut clamp ○ High-speed bonding head that realizes low inertia ○ Equipped with dual-frequency ultrasonic transducer ○ Supports wide area ○ Two-color LED lighting ○ Support functions for complex varieties ● For other functions and details, please download the catalog.
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Company information
Kaijo has been providing total ultrasonic solutions globally that fit customer needs by incorporating cutting-edge electronics/mechatronics technology based on the ultrasonic technology cultivated since its founding in 1948. The ODM division aims to enable a wider range of customers to utilize these foundational technologies more than ever before. - Contract development (ODM) is available from a single unit. - We manufacture transducers and oscillators tailored to customer requests. - We have experimental and evaluation facilities equipped with clean rooms, providing a robust evaluation environment for prototypes. - Some rental units are also available, allowing customers to evaluate before placing an order. - Our Matsumoto facility (Nagano Prefecture) has a manufacturing line registered for medical device manufacturing and has obtained ISO13485 certification. ■ Contact phone (direct) 042-555-2398 ■ Contact email odm-info(at)kaijo.co.jp <Please change (at) to @>