Semiconductor Manufacturing Equipment - Company Ranking(4 companyies in total)
Last Updated： Aggregation Period:Jul 16, 2025〜Aug 12, 2025
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| Company Name | Featured Products | ||
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| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Specifications】 ○ Equipment price: 1/10 of existing flip chip bonders ○ Weight: Target 50kg ○ Bonding load: 20N ○ Bonding temperature: 170℃ (no ultrasound required) ○ Size: 0.7×0.8×0.8m ○ Power supply: 100V-120V/1Φ ○ Clean room: Not required, chemical-free ● For more details, please contact us or download the catalog. | For more details, please contact us or download the catalog. | ||
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コネクテックジャパン
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- Featured Products
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Semiconductor manufacturing equipment "Desktop Flip Chip Bonder"
- overview
- 【Specifications】 ○ Equipment price: 1/10 of existing flip chip bonders ○ Weight: Target 50kg ○ Bonding load: 20N ○ Bonding temperature: 170℃ (no ultrasound required) ○ Size: 0.7×0.8×0.8m ○ Power supply: 100V-120V/1Φ ○ Clean room: Not required, chemical-free ● For more details, please contact us or download the catalog.
- Application/Performance example
- For more details, please contact us or download the catalog.
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コネクテックジャパン
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