No clean room needed! A flip chip bonder that makes factory miniaturization possible.
The "Desktop Flip Chip Bonder" enables the construction of a compact semiconductor assembly line without the need for a clean room by combining local clean technology. Since it does not use special chemicals and produces no noise, factories can be established anywhere. With a building the size of a convenience store, it is possible to freely construct a multi-variety, variable production line, allowing for a rapid response to market needs and the establishment of necessary production systems. 【Features】 ○ No clean room required ○ Factory miniaturization is achievable ○ Capable of multi-variety, variable production ○ Realizes Industry 4.0 For more details, please contact us or download the catalog.
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basic information
【Specifications】 ○ Equipment price: 1/10 of existing flip chip bonders ○ Weight: Target 50kg ○ Bonding load: 20N ○ Bonding temperature: 170℃ (no ultrasound required) ○ Size: 0.7×0.8×0.8m ○ Power supply: 100V-120V/1Φ ○ Clean room: Not required, chemical-free ● For more details, please contact us or download the catalog.
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Company information
Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.