laser - Company Ranking(7 companyies in total)

Last Updated：Aug 20, 2025 Aggregation Period:Jul 23, 2025〜Aug 19, 2025
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Company Name	Company information	Featured Products
Company Name	Company information	Product Image, Product Name, Price Range	overview	Application/Performance example
佐用精機製作所	Address Hyogo/ number of employees 15 Business Activities Related semiconductor products with a track record in various services < Laser > VCSEL (Vertical-Cavity Surface-Emitting Laser) Frame Laser Canstem Laser < LED Lamp > Red Blue Green White Full Color Infrared Canstem LED UV LED High Brightness LED Multi-Wavelength LED < LED Display > Line Light Source Dot Matrix Monolithic Array LED Printer Head White LED 7-Segment LED Power LED Visible Light LED Infrared LED UV LED Array MINI LED Array < Microwave Devices > Pill-Type Schottky Barrier Diode VCO Module Microwave Sensor < Sensors > Magnetic Sensor Temperature Sensor Acceleration Sensor Infrared Sensor Pressure Sensor Photo Sensor Flow Sensor < Light Receiving Elements, etc. > Light Receiving Element Array Light Receiving and Emitting Element Module < Methods > Ag Paste Bonding Gold-Tin (AuSn) Bonding Bump Bonding Solder Bonding Thermal Compression Adhesive Hermetic Seal Reflow Solder Reflow Phosphor Coating ACP Bonding ACF Bonding Transfer Molding Resin Mold Molding Key Partners Ushio Electric Co., Ltd. SCREEN Holdings Co., Ltd. Kodenji Co., Ltd. Phoenix Electric Co., Ltd. Panasonic Corporation Idea System Co., Ltd. Other major listed companies related to research and development: 950 companies with transaction records.	Sayou Seiki Seisakusho Co., Ltd. Company Profile Other	【Main Processed and Assembled Products】 ■ Can Stem Laser ■ Infrared LED ■ Special Laser ■ Ultraviolet LED ■ Numeric Display LED ■ Photodiode ■ Linear Light Source LED ■ Special Sensor ■ Dot Matrix LED ■ Special Element Assembly ■ Comprehensive LED ■ AuSn Bonding ■ Power LED ■ Other Opto Devices ■ Other Opto Device Assembly *For more details, please refer to the PDF document or feel free to contact us.	For more details, please refer to the PDF document or feel free to contact us.
		Principles of Joining Imagery and Troubleshooting Focus Points Other	You can view the detailed content of the column in the PDF document. For more information, please feel free to contact us.	You can view the detailed content of the column in the PDF document. For more information, please feel free to contact us.
		Points to consider when designing components with flip chip using AuSn joints. Other	You can view the detailed content of the column in the PDF document. For more information, please feel free to contact us.	You can view the detailed content of the column in the PDF document. For more information, please feel free to contact us.
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佐用精機製作所

Address

Hyogo/

number of employees

15

Business Activities

Related semiconductor products with a track record in various services < Laser > VCSEL (Vertical-Cavity Surface-Emitting Laser) Frame Laser Canstem Laser < LED Lamp > Red Blue Green White Full Color Infrared Canstem LED UV LED High Brightness LED Multi-Wavelength LED < LED Display > Line Light Source Dot Matrix Monolithic Array LED Printer Head White LED 7-Segment LED Power LED Visible Light LED Infrared LED UV LED Array MINI LED Array < Microwave Devices > Pill-Type Schottky Barrier Diode VCO Module Microwave Sensor < Sensors > Magnetic Sensor Temperature Sensor Acceleration Sensor Infrared Sensor Pressure Sensor Photo Sensor Flow Sensor < Light Receiving Elements, etc. > Light Receiving Element Array Light Receiving and Emitting Element Module < Methods > Ag Paste Bonding Gold-Tin (AuSn) Bonding Bump Bonding Solder Bonding Thermal Compression Adhesive Hermetic Seal Reflow Solder Reflow Phosphor Coating ACP Bonding ACF Bonding Transfer Molding Resin Mold Molding

Key Partners

Ushio Electric Co., Ltd. SCREEN Holdings Co., Ltd. Kodenji Co., Ltd. Phoenix Electric Co., Ltd. Panasonic Corporation Idea System Co., Ltd. Other major listed companies related to research and development: 950 companies with transaction records.

Featured Products

Sayou Seiki Seisakusho Co., Ltd. Company Profile

overview

【Main Processed and Assembled Products】 ■ Can Stem Laser ■ Infrared LED ■ Special Laser ■ Ultraviolet LED ■ Numeric Display LED ■ Photodiode ■ Linear Light Source LED ■ Special Sensor ■ Dot Matrix LED ■ Special Element Assembly ■ Comprehensive LED ■ AuSn Bonding ■ Power LED ■ Other Opto Devices ■ Other Opto Device Assembly *For more details, please refer to the PDF document or feel free to contact us.

Application/Performance example

For more details, please refer to the PDF document or feel free to contact us.

Principles of Joining Imagery and Troubleshooting Focus Points

overview

*You can view the detailed content of the column in the PDF document. For more information, please feel free to contact us.*

Application/Performance example

*You can view the detailed content of the column in the PDF document. For more information, please feel free to contact us.*

Points to consider when designing components with flip chip using AuSn joints.

overview

*You can view the detailed content of the column in the PDF document. For more information, please feel free to contact us.*

Application/Performance example

*You can view the detailed content of the column in the PDF document. For more information, please feel free to contact us.*
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Address

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Business Activities

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laser - Company Ranking(7 companyies in total)

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