Printed Wiring Board - Company Ranking(16 companyies in total)
Last Updated： Aggregation Period:Jul 23, 2025〜Aug 19, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【R-1766 Specifications (Partial)】 ■Substrate Manufacturer: Panasonic ■UL/ANSI Grade: FR-4.0 ■Main Applications: Communication, Automotive, etc. ■Glass Transition Temperature ・TMA Method: 140 ・DMA Method: 150 *For more details, please refer to the PDF document or feel free to contact us. | For more details, please refer to the PDF document or feel free to contact us. | ||
| 【Features】 〇 Flattening of surface mount pads by partial filling only in the BGA/CSP area (supports up to 0.35mm pitch) 〇 Permanent filling of all mini Via holes 〇 Manufacturing of various flat through-hole PCBs according to product specifications ● For other functions and details, please contact us. | 【Applications】 〇 Printed circuit boards (multilayer boards, BGA/CSP high-density boards, flat through-holes, aluminum boards, and other special wiring boards for consumer and industrial use prototype manufacturing) 〇 Laser drawing, CAM editing, precision industrial photography, complete screen printing ● For other functions and details, please contact us. | ||
Direct Imaging System
Other |
【Features】 ■ High-Difficulty Fine Patterns - Pad Pitch: 0.5mm - Outer Layer L/S: 60/70μm - Maximum Board Thickness: 1.6t - Pad Diameter: φ0.3mm - Drill Diameter: φ0.15mm - Number of Layers: 4 to 12 layers - Material Used: General FR-4; High Tg FR-4 - Special: Outer Layer 5μm Copper Foil (Peelable Copper Foil) ■ Fine Pattern Formation ◎ Applicable to Fine Pattern Products - 0.3mm to 0.65mm Pitch BGA/CSP Mounted Boards - Flip Chip Mounted Boards ■ Resist Formation ◎ Applicable to Products with High Alignment Accuracy - Pattern Resist Alignment Accuracy Requirement: ±20μm (Special Products) - Pattern Resist Alignment Accuracy Requirement: ±50μm *For more details, please refer to the PDF document or feel free to contact us. | For more details, please refer to the PDF document or feel free to contact us. | |
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スクリーンプロセス
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- Featured Products
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<Super Short Delivery Time> Base Material Specification Sheet
- overview
- 【R-1766 Specifications (Partial)】 ■Substrate Manufacturer: Panasonic ■UL/ANSI Grade: FR-4.0 ■Main Applications: Communication, Automotive, etc. ■Glass Transition Temperature ・TMA Method: 140 ・DMA Method: 150 *For more details, please refer to the PDF document or feel free to contact us.
- Application/Performance example
- For more details, please refer to the PDF document or feel free to contact us.
Special Technology Flat Through Hole (Pad On Via Hole)
- overview
- 【Features】 〇 Flattening of surface mount pads by partial filling only in the BGA/CSP area (supports up to 0.35mm pitch) 〇 Permanent filling of all mini Via holes 〇 Manufacturing of various flat through-hole PCBs according to product specifications ● For other functions and details, please contact us.
- Application/Performance example
- 【Applications】 〇 Printed circuit boards (multilayer boards, BGA/CSP high-density boards, flat through-holes, aluminum boards, and other special wiring boards for consumer and industrial use prototype manufacturing) 〇 Laser drawing, CAM editing, precision industrial photography, complete screen printing ● For other functions and details, please contact us.
Direct Imaging System
- overview
- 【Features】 ■ High-Difficulty Fine Patterns - Pad Pitch: 0.5mm - Outer Layer L/S: 60/70μm - Maximum Board Thickness: 1.6t - Pad Diameter: φ0.3mm - Drill Diameter: φ0.15mm - Number of Layers: 4 to 12 layers - Material Used: General FR-4; High Tg FR-4 - Special: Outer Layer 5μm Copper Foil (Peelable Copper Foil) ■ Fine Pattern Formation ◎ Applicable to Fine Pattern Products - 0.3mm to 0.65mm Pitch BGA/CSP Mounted Boards - Flip Chip Mounted Boards ■ Resist Formation ◎ Applicable to Products with High Alignment Accuracy - Pattern Resist Alignment Accuracy Requirement: ±20μm (Special Products) - Pattern Resist Alignment Accuracy Requirement: ±50μm *For more details, please refer to the PDF document or feel free to contact us.
- Application/Performance example
- For more details, please refer to the PDF document or feel free to contact us.
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スクリーンプロセス
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