Notice of Participation in the 54th National Door Exhibition in Asakusa, Tokyo from November 11 (Friday) to November 12 (Saturday), 2022.

Easy, fast, high quality! High-frequency flash bonding machine that achieves excellent production efficiency.

"BONDEX" is a high-frequency flash adhesive machine that is easy to operate. Once the materials are prepared and set, just press a button to start the adhesion. With quick activation and simultaneous bonding of multiple items, production time can be significantly reduced. High-frequency bonding has a short press time, which minimizes the appearance of core material marks on the surface material. We have newly added the space-saving "BONDEX-V," which accommodates custom furniture and interior doors, and the high productivity "BONDEX-VX," which finishes interior doors with two presses. 【Features】 ■ Once the materials are prepared and set, just press a button to start the adhesion. ■ Easily change the setting conditions to meet the needs of small-batch production of various types. ■ Achieve speed bonding in just 30 seconds even when using woodworking glue. ■ Quick activation and simultaneous bonding of multiple items significantly reduce production time. ■ Since only the adhesive is heated by high frequency, deformation and warping are minimized. ■ High-frequency bonding has a short press time, making it less likely to leave core material marks on the surface material. *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

Easily, quickly, and with high quality. Our high-frequency technology guarantees it.

The "BONDEX-V" is a high-frequency flash bonding machine that can widely accommodate custom furniture and interior doors. In cold pressing, the curing time for flash panels takes several tens of minutes to several hours, making it impossible to move on to the next task immediately. However, with the "BONDEX-V," bonding of flash panels can be completed in just "30 seconds," leading to overwhelming productivity improvements. Additionally, because it heats with high frequency, it reduces material warping and eliminates core material marks, resulting in superior "finish quality." The new space-saving model "BONDEX-V" has been made more compact, with a depth of about 60 cm, due to the integration of the high-frequency oscillator and the main unit, as well as the miniaturization of high-frequency components (see the third photo). Also, with casters, it is easy to transport and move! The structure of the grid electrodes, which alternate between positive and negative electrodes, has been significantly improved, reducing maximum input by about 31% (compared to the conventional model BONDEX-8R), contributing to energy cost savings. *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

Can be used with a household power supply of 100V! The tip iron part can be easily exchanged with a one-touch gun.

This product is a lightweight, portable high-frequency compact heating adhesive machine that operates on a 100V power supply. It comes standard with an automatic tuning device, eliminating the need for troublesome adjustments. No preheating is required, so you can start heating work immediately after turning on the power. It can be used for edge bonding, fastening bonding, corner bonding, and for bonding wood, paper, and cardboard. 【Features】 ■ Usable with a household 100V power supply ■ The tip iron and gun can be exchanged with a single touch ■ No preheating required; you can start heating work immediately after turning on the power ■ Comes standard with an automatic tuning device, eliminating the need for troublesome adjustments *For more details, please refer to the PDF document or feel free to contact us.

• Wood processing machinery

Our company will be exhibiting at the "16th Advanced Functional Materials Week Tokyo" held at Makuhari Messe, specifically at the "8th Coating Japan: Paints and Coating Equipment Exhibition." This exhibition is a specialized event where functional paints, coating equipment, surface treatment technologies, and more will be showcased all in one place. A wide range of engineers from industrial fields such as electronics and automotive to architecture and building materials will be in attendance. At this exhibition, you can discover new products and technologies, consult directly with engineers, discuss estimates and implementation timelines, and learn about industry trends. We sincerely look forward to your visit.

■Accelerating Next-Generation Polymer Design: Digital Chemistry Platform■ With the evolution of molecular simulation technology, we have entered an era where phenomena at the atomic and molecular levels can be reproduced and analyzed on computers. Furthermore, by combining this with machine learning, it has become possible to achieve high-precision material predictions and designs even with limited experimental data. Schrödinger strongly supports the enhancement of your analytical capabilities and the efficiency of research and development through cutting-edge molecular simulation and AI/ML technologies, as well as our unique digital platform that integrates these technologies. At this exhibition booth, our specialized staff will clearly introduce an overview of these technologies and case studies, and will also answer any questions you may have. *During the exhibition, we will hold a seminar at our booth. Location: Our exhibition booth Theme: Accelerating Next-Generation Polymer Material Development with Machine Learning and Atomic-Level Simulation 【Exhibition Information】 Exhibition Name: 14th High-Performance Plastics Exhibition within High-Functionality Materials Week Dates: November 12 (Wednesday) to 14 (Friday), 2025, 10:00 AM to 6:00 PM (ends at 5:00 PM on the last day) Venue: Makuhari Messe Halls 1-3 Booth Number: 15-10

We will showcase flexible busbars that can also be used in vehicles. Additionally, we will display various power supplies for precision welding machines, as well as automatic machines and processing electrodes.

NVIDIA, a partner company of ADLINK Japan, will hold the "Latest Technology Session by NVIDIA Partners" at the 2025 Japan IT Week [Autumn], where ADLINK Japan's Kiuchi will present on the theme "Introduction to Embedded AI Solutions for TCO Reduction." This is an open seminar that is free and does not require prior registration, so please join us.

This exhibition is one of the largest comprehensive exhibitions for embedded and edge technology in Japan, focusing on design philosophy based on AI, secure by design, and building resilient supply chains. It provides an overview of the entire embedded ecosystem, covering everything from institutional and market trends to on-site implementation, allowing attendees to experience the forefront of transformation in embedded technology. At the D-Link booth, we will introduce our "4G/5G M2M products," which can be widely used from offices and stores to embedded devices, factory equipment, and in-vehicle systems, along with the cloud management platform "D-ECS" that streamlines operations after implementation. We will also showcase the "DIS series," an industrial switch with excellent durability, featuring a wide operating temperature range from -40°C to 75°C and compliance with IP protection ratings.