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  4. Announcement of participation in "DiS World 2022 in Echigo Niigata with Digital Days"
SEMINAR_EVENT
  • Oct 24, 2022
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Oct 24, 2022

Announcement of participation in "DiS World 2022 in Echigo Niigata with Digital Days"

FXC FXC
FXC will be exhibiting at "DiS World 2022 in Echigo Niigata with Digital Days," which will be held from November 16. This event aims to promote regional revitalization and community contribution through IT technology, with the theme "Revitalizing towns, people, and work through digital transformation." Niigata is famous for its beautiful sunsets over the Sea of Japan, delicious rice such as Koshihikari, and fresh seafood, all set against a backdrop of rich natural scenery and cuisine. However, it is also home to a diverse range of industries, including machinery, metalworking, papermaking, chemical manufacturing, and food production, making it a core area of the Hokuriku industrial region. About 200 prominent companies will gather in this resource-rich and industrially active area to provide the latest technologies and services for sustainable regional development. 【Exhibition Overview】 ◆ Date: November 16 (Wednesday) to November 17 (Thursday), 2022 ◆ Venue: Toki Messe Niigata Convention Center ◆ Organizer: Daiwabo Information System Co., Ltd. ◆ Official URL: https://www.dis-world.com/niigata/
Date and time Wednesday, Nov 16, 2022 ~ Thursday, Nov 17, 2022
Capital Venue: Toki Messe Niigata Convention Center
Entry fee Free
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Related product

ipros_LEX1881-1F.jpg

10G Electric/Optical Media Converter "LEX1881-1F"

Ultra-compact! 10GBASE-T/R (SFP+) compatible media converter [Interop Best of Show Award Judge's Special Award]

The "LEX1881-1F" is a super compact media converter for 10G electrical/optical connections. It can be mounted in a modular chassis (LEX1012-15/45). The 10G optical module uses SFP+ and supports 10GBASE-SR/LR/ER/ZR. Single-core types (20km/40km/60km) and CWDM-compatible SFP+ are also available. It transmits repeater operation, jumbo frames, and VLAN-tagged frames. 【Features】 ○ Supports Auto-Negotiation and Auto MDI/MDI-X ○ No frame size limitations or frame control (due to repeater operation) ○ Standards compliant: 10GBASE-T, 10GBASE-R ○ Equipped with LFP (Link Fault Pass-Through) function (configurable via DIP switch) ○ Equipped with LLR (Link Loss Return) function *For more details, please contact us or download the catalog for viewing.

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  • VPN/Wide Area Ethernet
  • Integrated operation management

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fxc_image.jpg

Media Converter "LEX1881-2F"

Transmits 4 lines over a single fiber! Ultra-compact Ethernet-compatible media converter.

The "LEX1881-2F" is a compact media converter that supports 10GbE. It can transmit 10G over 4 lines using a single fiber. It also offers a variety of mounting options, including magnets and rubber feet. 【Main Features】 ■ A 3R-compliant media converter that interconnects two 10G SFP+ ports (Reamplifying, Reshaping, Retiming) ■ No frame size limitations or transfer frame control (for repeater operation) ■ Standards compliant: 1000BASE-X, 10DBASE-R ■ Equipped with LFP (Link Fault Pass-Through) functionality ■ Various LED indicators on the front panel ■ Includes various mounting options *For more details, please refer to the catalog or feel free to contact us.

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  • Other network tools

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FXC9432 .png

L3 routing switch with management functions "FXC9432"

Network construction is possible with IPv6 alone! An L3 core switch that supports IGP/EGP routing and is optimal for diverse network environments.

The FXC9432 is a managed routing stackable switch equipped with 24 RJ45 ports for 10/100/1000BASE-T, 4 combo ports for RJ45/1G SFP, and 4 SFP+ ports for 1/10GBASE-R. It supports a variety of routing protocols, IPv6 routing, and functions as a core switch for small yet complex networks, including multicast routing. In addition to port-based VLANs, it supports IEEE802.1Q tagged VLANs, protocol-based VLANs, and Voice VLANs. It also includes security features such as 802.1x authentication and web redirect authentication, making it adaptable to diverse network environments such as hotels, offices, apartments, and campuses. Furthermore, it allows for hardware stacking of up to 9 units via the front 10G ports, enabling port expansion and the construction of highly resilient networks. An optional redundant power supply unit will also be released simultaneously. For more details, please contact us or download the catalog.

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SNMP management card "LEX3930-00"

LEX3000 Series Option SNMP Management Card

The "LEX3930-00" is an SNMP management card compatible with the "LEX3020," allowing for monitoring the status of the power supply unit and fan unit installed in the chassis, as well as the link status of each media converter in the LEX3000 series and various settings via the network. It also supports monitoring settings for adjacent line cards using Link OAM (IEEE802.3ah) and wide area Ethernet status monitoring using Ethernet OAM (IEEE802.1ag / ITU-T Y.1731). ● For more details, please contact us or download the catalog.

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Ethernet OAM compatible media converter LEX3821-2F

100BASE-FX/1000BASE-X media converter

■Achieved the world's smallest size (※1) as a Gigabit media converter supporting Ethernet OAM. ■Uses SFP for optical modules. Compatible with 100BASE-FX/1000BASE-SX/SX2/LX/ZX. Single-core types (BiDi/BX) and CWDM-compatible SFPs are also available! ■Switch operation. Supports jumbo frames. ■Supports power loss notification function (Dying Gasp). ■Signal Detect can be confirmed via LED. ■Fanless design, made in Japan, domestic quality. (※1) Based on our research for standalone (single unit) Gigabit media converters supporting Ethernet OAM. ●For more details, please contact us or download the catalog.

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[Online Seminar] Changing Machining: What Companies Can Achieve with the Implementation of Monitoring Systems (February 12)

  • NEW
  • SEMINAR_EVENT

We will hold an online seminar as follows. The corporate perspective on the introduction of monitoring systems is changing year by year. We will explain the monitoring systems for machine tools that are currently needed, using various case studies to discuss the changes in the industry environment, what challenges customers perceive, their expectations for monitoring systems, and the effects of their implementation. This seminar will provide insights into specific approaches for your company's introduction of monitoring systems. Date and Time: February 12, 2025 (Thursday) 14:00 - 15:00 Instructor: Monitoring System Representative, ARTIS (MARPOSS Corporation Sales Development Department) Target Audience: - Customers considering the introduction of monitoring systems who want to know the specific process leading to implementation. - Customers interested in what challenges other companies have identified that led to the introduction of monitoring systems. - Customers researching the latest trends in monitoring systems for machine tools. We sincerely look forward to your participation.

Apr 01, 2026

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4/14 Webinar: Water and Oil Repellent Treatment Achievable Without Fluoride

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  • SEMINAR_EVENT

■Title: "Fluorine-Free Water and Oil Repellent Treatment Technology Achievable - Guidelines and Examples for Surface Design to Improve Wetting Fundamentals and Liquid Sliding Properties" As PFAS regulations accelerate, surface designs that achieve water and oil repellency without fluorine are gaining attention. This seminar will systematically explain the fundamentals of wetting, dynamic wettability evaluation, design guidelines for improving sliding properties, and the latest examples of fluorine-free surface treatments by leading researchers. ■Date and Time: April 14, 2026 (Tuesday) 13:30 - 16:30 ■Target Audience for the Seminar - Individuals engaged in surface treatment and modification operations - Those involved in research and development related to imparting water and oil repellency, stain resistance, and anti-adhesion properties to various substrate surfaces - Individuals engaged in research and development of fluorine (PFAS) alternative technologies and fluorine-free surface treatment and modification technologies ■Knowledge Gained from the Seminar - Fundamental knowledge/theory regarding wettability - Correct knowledge of wettability evaluation techniques (static/dynamic contact angle, contact angle hysteresis, sliding/falling angle) - Know-how for creating surfaces/interfaces with excellent water and oil repellency, stain resistance, and anti-adhesion properties without fluorine

Mar 31, 2026

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Announcement of Participation in Jumbo Surprise Expo 2026

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  • SEMINAR_EVENT

The "Jumbo Surprise Exhibition," which solves the challenges faced by the manufacturing industry all at once, will be held again this year. In the FA zone, the latest FA equipment, control and drive devices, and energy-saving and labor-saving proposals will be displayed all in one place. You can experience concrete solutions that are immediately useful on-site, such as automation, productivity improvement, equipment renewal, and maintenance efficiency. Representatives from each manufacturer will be available to provide direct explanations, making it a great opportunity to learn about the latest trends and case studies. If you are looking for hints to solve your challenges or considering new equipment investments, please come and visit us. We will provide encounters that will lead your business to the next stage.

Mar 31, 2026

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4/15 Webinar "Flexible Substrates for 5G/6G"

  • NEW
  • SEMINAR_EVENT

■Title: "Flexible Substrates and FPC Formation Technology for 5G/6G - LCP-FCCL and Its Development" ――A must-see for developers of high-frequency FPCs. Provides knowledge useful for future FPC substrate design, from the key technologies for LCP multilayering to examples of new low-dielectric films. ■Date and Time: April 15, 2026 (Wednesday) 13:30 - 16:30 ■Target Audience for the Seminar  Development engineers engaged in the development of high-frequency FPCs and their substrates ■Knowledge Gained from the Seminar  ・Basic properties required for FPC substrates  ・Reasons for using LCP and polyimide films in FPCs  ・Key technologies for LCP multilayering  ・Points to consider when processing LCP films  ・Examples of hybridization methods between LCP and low-dielectric materials

Mar 31, 2026

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April 10 Webinar: Comprehensive Explanation of Basic Information on Semiconductor Packaging Technology

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  • SEMINAR_EVENT

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. A leading expert thoroughly organizes practical perspectives from WLP/PLP to high thermal conductivity materials. ■ Title: Basic Information on Semiconductor Packaging Technology: Comprehensive Explanation ■ Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM ■ Target Audience for the Seminar - Individuals involved in semiconductor packaging (sales, technology) - Those interested in semiconductor packaging technology - Those interested in semiconductor resin encapsulation and encapsulation materials ■ Knowledge Gained from the Seminar - Development history of semiconductor packaging (PKG) - Development history of semiconductor packaging technology (methods, materials) - Specifications of semiconductor encapsulation materials (raw materials, composition, manufacturing equipment, evaluation methods, etc.)

Mar 31, 2026

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  • 展示会に出展したいけど準備が大変 展示会の情報をまとめて知りたい そんな展示会のお悩み 展サポで解決! ブース装飾で実績豊富 展示会情報を多数掲載 出展前~後まで支援
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