[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution

Fresh refrigerant spreads evenly within the plane! It is possible to reduce temperature unevenness, improve cooling efficiency, and achieve low thermal resistance.

A heat sink is a component used to cool absorbed heat, commonly used when dissipating heat from heat sources such as CPUs. Many designs utilize a structure called "fins" to release heat into the air or to flow water internally to absorb heat. Our company designs, manufactures, and sells water-cooled heat sinks, which we refer to as "microchannel heat sinks." The "water-cooled microchannel heat sink" allows fresh coolant to evenly distribute across the surface, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. 【Structure】 ■ Matrix structure ■ Distribution flow path ■ Microchannel flow paths arranged across the entire cooling surface ■ Internal structure that evenly distributes coolant to all flow paths *For more details, please refer to the PDF materials or feel free to contact us.

• Other environmental equipment
• Heat exchanger

Uniform temperature across the entire surface with matrix flow channels! We also accommodate custom orders and mass production.

The "M4040/M2020" is a microchannel heat sink that is effective for heat removal from high heat density sources. In the commonly seen "single flow path," there is a "temperature variation" on the cooling surface. WELCON's fluid distribution design technology achieves effective heat absorption from high heat density sources through uniform cooling. By improving the heat absorption density compared to conventional products, it enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping. There is a proven track record of mass production for cooling CPUs in supercomputers. When combined with heat exchangers, precise temperature control is possible. 【Features】 ■ 260W/cm² heat absorption ■ Uniform temperature across the entire surface due to matrix flow paths ■ Customizable ■ Achieves low flow rate and low thermal resistance ■ Enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping *For more details, please refer to the PDF document or feel free to contact us.

• Other environmental equipment

It is possible to cool uniformly without temperature variation! We offer customization of standard products and prototype development from scratch.

Many existing heat sinks have a simple structure known as a 1-path structure, where the flow path from the inlet to the outlet is connected by a single line. In this case, there is a temperature variation between the inlet side, where fresh refrigerant is supplied, and the outlet side, where the refrigerant is heated by the heat source. The heat sinks provided by WELCON as standard products can cool uniformly without temperature variation. They feature a "matrix flow path" that implements microchannels with fine chambers like those in liquid crystals, allowing fresh refrigerant to be distributed uniformly. [Features] - No temperature variation - Can cool uniformly - Fresh refrigerant is distributed uniformly by implementing fine chambers like those in liquid crystals with microchannels *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Heat exchanger
• air conditioning

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without affecting the base material with heat. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

● The production time for cast prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or varying dimensions, can be molded at the same time in one molding process. This allows for the verification of multiple types in a short period.

Last month, we held a spring safety conference hosted by our company. We have compiled the details and atmosphere of the day into a PDF. We would appreciate it if you could take a moment to read it.

In recent years, as the importance of data integrity (DI) compliance in GMP environments has increased, there has been a growing call to deepen understanding of 21 CFR Part 11. This content introduces an on-demand presentation that organizes the background of Part 11, its relationship with DI, and its positioning in CSA guidance, while explaining the basic concepts of electronic records and electronic signatures. ■Content - Background and basic concepts of Part 11 - Relationship with data integrity (DI) - Positioning in CSA guidance - Basic requirements for electronic records/electronic signatures *This content is based on information as of March 17, 2026. *The information provided is intended for general informational purposes and does not guarantee specific compliance or suitability.