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  5. Heat exchanger
  6. Case Study of Microchannel Heat Sink Development

Case Study of Microchannel Heat Sink Development

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last updated:Feb 02, 2021

WELCON 本社
WELCON 本社
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It is possible to cool uniformly without temperature variation! We offer customization of standard products and prototype development from scratch.

Many existing heat sinks have a simple structure known as a 1-path structure, where the flow path from the inlet to the outlet is connected by a single line. In this case, there is a temperature variation between the inlet side, where fresh refrigerant is supplied, and the outlet side, where the refrigerant is heated by the heat source. The heat sinks provided by WELCON as standard products can cool uniformly without temperature variation. They feature a "matrix flow path" that implements microchannels with fine chambers like those in liquid crystals, allowing fresh refrigerant to be distributed uniformly. [Features] - No temperature variation - Can cool uniformly - Fresh refrigerant is distributed uniformly by implementing fine chambers like those in liquid crystals with microchannels *For more details, please refer to the PDF document or feel free to contact us.

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Case Study of Microchannel Heat Sink Development

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  • Related Link - https://welcon.co.jp/core/prototype.html

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【Regarding Prototype Development Requests】 ■Customization of Standard Products - Responding to customer requests regarding shapes, performance, specifications, and usage environments that cannot be covered by standard products. ■Prototype Development from Scratch - If customization of standard products is difficult, we will conduct prototype development from the ground up. *For more details, please refer to the PDF document or feel free to contact us.

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Processing "micro 3D structures"

Processing "micro 3D structures"

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Heat spreader low thermal expansion high thermal conductivity material "WEL-Therm"

Heat spreader low thermal expansion high thermal conductivity material "WEL-Therm"

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Microchannel Heat Sink 'M4040/M2020'

Microchannel Heat Sink 'M4040/M2020'

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Vapor Chamber "WEL-HeatRibbon"

Vapor Chamber "WEL-HeatRibbon"

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WEL-Cool Heat Exchanger PF0.5

WEL-Cool Heat Exchanger PF0.5

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WEL-Cool Heat Exchanger CF0.5

WEL-Cool Heat Exchanger CF0.5

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Microchannel Heat Exchanger "WEL-Cool"

Microchannel Heat Exchanger "WEL-Cool"

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[Explanatory Material] What is a Water-Cooled Microchannel Heat Sink? *Free Distribution

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Fresh refrigerant is evenly distributed within the plane! It is possible to reduce temperature variations, improve cooling efficiency, and achieve low thermal resistance. A heat sink is a component used to cool absorbed heat, commonly used when dissipating heat from heat sources like CPUs, often utilizing a structure called "fins" to release heat into the air or to absorb heat by flowing water inside. Our company designs, manufactures, and sells water-cooled heat sinks, referred to as "microchannel heat sinks." The "water-cooled microchannel heat sink" allows fresh refrigerant to be evenly distributed within the plane, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. [Structure] - Matrix structure - Distribution flow path - Microchannel flow paths arranged across the entire cooling surface - Internal structure that ensures refrigerant is evenly distributed across all flow paths *For more details, please refer to the PDF document or feel free to contact us. https://www.ipros.jp/product/detail/2000726009

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WELCON

WELCON 本社

Manufacturing and processing contract

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High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.

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