Thank you for attending: Nepcon Japan 2023 Autumn @ Makuhari Messe

High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

Lambda2 is a new standard model of high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact desktop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies, including thermal compression, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact desktop size, it offers a very user-friendly scale for equipment installation, and with future expandability through a modular system, it represents a highly cost-effective model. Lambda2 is a new standard model from Fine Tech, a German manufacturer specializing in die bonders, which has poured its unique know-how into it. The ultra-high precision and usability achieved through its unique design philosophy are unmatched by other manufacturers. For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

The "pico 2" is a multipurpose die bonder with a mounting accuracy within 3μm. With quick setup and easy operation, it is suitable for rapid and flexible product development and prototyping in corporate laboratories and universities. Additionally, thanks to its modular design philosophy, new functions can be added even after the equipment has been installed, allowing for easy integration throughout the equipment's lifespan. 【Features】 ■ Compact tabletop die bonder ideal for prototyping and research and development ■ Simple operation for alignment using a unique vision alignment system ■ Supports various mounting processes such as thermocompression, soldering, ultrasonic, and adhesive ■ Integrated process control (heat, temperature, load, etc.) via IPM commands ■ Accommodates a wide range of component sizes (0.05mm to 100mm) ■ Cost-effective equipment configuration through a modular system *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

Fully automatic high-precision die bonding machine

The model name femto2 from the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.3μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely shields against external influences, achieving a top-class yield and a stable assembly process. *For more details, please download the PDF or contact us.*

• Other semiconductor manufacturing equipment

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

The model name sigma of the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N in a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, accommodating MEMS/MOEMS assembly, bonding of image sensors, and chip packaging at the wafer level. FINEPLACER sigma is a model designed for development applications that support assembly technologies aimed at the future, catering to a variety of technologies and applications.

• Bonding Equipment

[Lecturer] NTT Corporation, Network Service Systems Research Institute Network Infrastructure Technology Project, Project Manager Fujihiko Tamura [Key Lecture Content] The All-Photonics Network (APN), which is a core component of the IOWN concept proposed by NTT in 2019, is a high-capacity, low-latency, and low-power optical infrastructure that began commercial service as APN IOWN 1.0 in 2023. Currently, it is offered as a bandwidth-guaranteed communication service between user sites at speeds of up to 800 Gbps, and APN is steadily evolving. In the future, to respond to the rapid development of AI and data centers, as well as the diversifying user needs, we are advancing research and development for APN Step 3, which aims to provide on-demand, end-to-end optical connections on a broad scale. In this lecture, I will explain the world that APN Step 3 aims for, the technologies that support its realization, and our efforts in standardization activities and demonstration experiments at IGF (IOWN Global Forum) and ITU-T.

[Speaker] Hajime Hiraki, CEO of Chemistry Cube, Innovation Consultant [Key Lecture Content] Inventorying technology is not merely about listing and categorizing technologies or creating a technology inventory; in other words, it is not just about managing technology stock. It is a process that visualizes technology as a "structure" and reconstructs the researcher’s own thinking, fundamentally enhancing the strategic planning and theme creation capabilities in R&D settings. In this lecture, we will explain how technology generates value and how it can be utilized across organizations using the technology structuring method iMapR practiced by Chemistry Cube. We will also discuss how the speed and quality of inventorying can be improved through collaboration between generative AI and engineers/researchers. This is essential content for executives and technology leaders who want to accelerate transformation in R&D. [Lecture Items] 1. Introduction 2. What is technology inventorying? 3. How technology inventorying changes R&D settings 4. Practical application of the technology structuring method iMapR 5. Technology inventorying in the era of generative AI 6. Towards deployment in R&D settings 7. Q&A / Business card exchange

Announcement of a workshop hosted by Fukushima Prefecture High-Tech Plaza. Creating the Future of Manufacturing: Problem-Solving Workshop ~ Learn approaches to identify and solve on-site challenges ~ Are you interested in generative AI but haven't taken the plunge yet? Let's take that step together. We will hold an intensive workshop where you can learn the basics of "safely, smartly, and practically" using AI and problem-solving techniques in just 2.5 hours. <Recommended for> - Those who want to eliminate daily "minor inconveniences" and "vague inefficiencies" with AI - Those who want to quickly catch up on the basics of generative AI and safe usage - No restrictions on industry or job type. Those who want to work hands-on in teams and experience concrete outputs <What you will gain> - Experience a problem-solving framework starting from problem discovery → definition → visualization → solution proposals based on on-site challenges - Acquire the basics of generative AI prompts and risk management (copyright, confidentiality, hallucination) from a practical perspective - Take home improvement ideas that can be used starting tomorrow through group work <What to bring/wear> No specific items required. Dress is casual. Please feel free to join us. We sincerely look forward to your participation!

Ladies and gentlemen, do you have any concerns about using Excel for data aggregation and report creation in your daily work? - Spending hours every month matching multiple Excel files through copy-pasting or VLOOKUP - When opening large datasets, your PC freezes, and you have to wait until the processing is complete - The macros you've created are too complex for anyone other than the creator to fix (dependency on individuals) Alteryx is generally recognized as a "self-service data analytics platform" and a "no-code/low-code ETL tool." While the first benefits that come to mind when implementing Alteryx may be efficiency and automation, the advantages of adopting Alteryx go beyond just that. In this seminar, we will introduce how Alteryx can streamline and automate the tasks you struggle with daily in Excel, and how it can help you step up to more advanced analysis, along with specific use cases.

[Speaker] Tadahiro Maruyama, Director of the Business Creation Division, Chubu Electric Power Co., Inc. (Also Deputy COO of Chuden Telemetering LLC) [Key Lecture Content] Chubu Electric Power is expanding telemetering through a smart meter communication network to gas and water services. In the next phase, we aim to integrate these accumulated data into a multi-infrastructure DX business, merging with energy and water services, and striving for a circular and sustainable community across our entire group. This time, I will explain the actual initiatives related to these efforts. [Lecture Items] 1. Automatic Meter Reading by Chubu Electric Power 2. Current Status of Chubu Electric Power's Telemetry Business 3. Business Transformation through Infrastructure DX in the Electric Power Sector 4. Horizontal Expansion of Infrastructure DX to Water Services 5. Smart City Services through Data Utilization 6. Q&A / Business Card Exchange