High-precision die bonder and flip chip bonder 'lambda2'

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. We are honored to have the opportunity to exhibit at the IEEE International 3D Systems Integration Conference (3DIC). We hope to engage with many guests while participating in this platform for presenting cutting-edge technologies related to semiconductor processes.

Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all those who visited us. We look forward to your continued support. ------------------------------------------------- At the Nepco Japan Autumn / Electronics Development and Implementation Exhibition, we will be showcasing our die bonding equipment at our booth. ■■■ Live Demonstration of FINE PLACER lambda2 ■■■ We will be exhibiting the compact tabletop die bonder/flip chip bonder lambda2. Fine Tech offers a wide range of products, from manual models to semi-automatic and fully automatic models. We will introduce high-precision implementation methods and the latest applications for various electronic devices, optical transmission and reception devices, MEMS, and micro components. We apologize for the inconvenience, but if you have time, please feel free to stop by.

Thanks to all of you, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank everyone who visited us. We look forward to your continued support. ------------------------------------------------- We would like to express our sincere gratitude for your exceptional support. Fine Tech Japan will be exhibiting at NEPCON Japan 2022 (Autumn). On that day, we will be showcasing a live demonstration of the high-precision die bonder lambda2. We will also be introducing other models and addressing any questions related to various die bonding techniques, so we sincerely look forward to your visit. Venue and Booth Number: Makuhari Messe, Hall 2 & 3, A5-30 Dates: August 31, 2022 (Wednesday) to September 2, 2022 (Friday) Time: 10:00 AM to 5:00 PM

Thanks to everyone, we were able to successfully conclude this exhibition. I would like to express my heartfelt gratitude, and I sincerely thank all of you who attended. We look forward to your continued support. Thank you very much for your exceptional patronage. Fine Tech Japan will be exhibiting at Nepcon Japan 2023. On the day of the event, we will be showcasing a live demonstration of the high-precision die bonder lambda2. We will also be introducing other models and addressing various questions related to die bonding, so we sincerely look forward to your visit.