Henkel launches the next-generation thermal gap filler for automotive applications, BERGQUIST GAP FILLER TGF 4400LVO - an ideal choice for efficient production of control units and ADAS sensors.

Henkel Adhesive Technologies is developing next-generation thermal gap fillers as innovative solutions tailored for demanding automotive applications, supporting our customers in tackling various challenges. The first product in Henkel's next-generation thermal gap filler lineup, the BERGQUIST GAP FILLER TGF 4400LVO, will be available for sale starting September 11, 2023. It allows for ultra-thin application and achieves both high-speed processing and high reliability. This two-component low-volatility silicone room-temperature curing gap filler is ideal for applications such as control units and ADAS components.
The BERGQUIST GAP FILLER TGF 4400LVO offers high thermal shock resistance and a high level of reliability, making it an easy-to-apply solution for ultra-thin applications. With a thermal conductivity value of 4.4 W/m·K and a very low content of volatile siloxanes, it is a more sustainable choice that is perfect for protecting delicate electronic components.


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