October Web Seminar Announcement

Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!

By being able to prepare the next workpiece in parallel during substrate processing, we can eliminate waiting time during substrate exchanges. Additionally, by shortening the cycle time, productivity can be improved without increasing the number of operators. The entire process of supplying printed circuit boards, cutting the substrates, and palletizing the cut substrates onto discharge trays can also be automated. (Substrate cutting machine + robot transport system) 【Features】 ■ Equipped with a dual-table automatic turn system that allows for parallel setup ■ Adaptable to general inline specifications through the use of robots ■ Reduction of cutting time through Z-axis height settings for each router location ■ Improved operating rate by monitoring the usage distance of bits and automatically replacing them ■ Built-in dust collector for compact device size *For more details, please download the PDF or contact us. ★ For those interested in the single type, click here▽ https://mono.ipros.com/product/detail/2000569194 ★ Free seminar here▽ http://www.mtco-web.co.jp/products/web_seminar.html

• Circuit board processing machine

Standalone type with high rigidity and quality, equipped with e-F@ctory utilization error prevention features, automatic router bit exchange, and image teaching capabilities.

The "MR2535H2" is a device that divides multiple small and complex-shaped circuit boards using a router method. It can cut printed circuit boards with low stress, thereby reducing the risk of damage to mounted components (such as multilayer ceramic capacitors) caused by stress in traditional hand-breaking or pressing methods. By utilizing automation and IT technologies cultivated at Mitsubishi Electric's Nagoya Works for equipment design and manufacturing, it supports improvements in factory productivity and quality. 【Features】 ■ Cuts unnecessary parts of complex-shaped printed circuit boards after mounting using a router bit ■ Improves setup efficiency by widening the opening width of the device's access door ■ Achieves space-saving by incorporating a dust collector within the device's lower section ■ Significantly enhances productivity by increasing the movement speed of the X-Y axis (three times faster than our conventional models) ■ Allows for setting the Z-axis position for each cutting point, enabling shorter takt times ■ Supports image teaching functions for setting cutting points on various types of circuit boards *For more details, please download the PDF or contact us.

• Circuit board processing machine

Inline model that automates the printed circuit board cutting process.

Automatically cuts various printed circuit boards in-line on the manufacturing line. It eliminates the need to always have an operator at the board cutting machine, achieving labor savings. 【Features】 ■ Monitors the usage distance of the bit and automatically replaces it to improve operational efficiency. ■ Waste boards are automatically collected into a waste board box located at the bottom of the device. ■ Selecting a twin spindle enables simultaneous cutting, achieving high productivity. *For more details, please download the PDF or contact us.

• Circuit board processing machine

High-quality fine printing is possible! Laser marking device for substrates compatible with a wide range of materials.

The substrate marking device is a laser-based substrate marking machine capable of directly marking serial numbers, origin, and two-dimensional codes or characters for process management using a laser marker. In addition to being equipped with a variety of functions, it also offers a range of options that enable integration with traceability systems. 【Features】 ■ High-speed marking of fine characters, 2D codes, and shapes at any position on printed circuit boards ■ More stable print quality compared to stamping methods ■ In the case of fiber lasers, it can accommodate a variety of materials such as metals and ceramics, allowing for higher precision printing compared to CO2 lasers ■ Creation of flexible printing programs in parallel with production at a workstation away from the PCB manufacturing line using Excel * Fiber lasers do not require permission applications as they are not subject to high-frequency utilization equipment regulations, making them easier to implement compared to conventional machines. * Microsoft and Excel are registered trademarks or trademarks of Microsoft Corporation in the United States and other countries. * For more details, please download the PDF or contact us.

• Laser marker

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Our company will be exhibiting at "POWTEX Powder Technology Exhibition Osaka 2025" held at Intex Osaka. During the event, we will showcase various products. We invite all related parties to come and visit us. 【Suppliers】 ・Hielscher

Our company will be exhibiting at the "Powder Technology Exhibition Osaka 2025" held at Intex Osaka. During the event, we will showcase various products. We invite all related parties to come and visit us. 【Suppliers】 ・Hielscher

Our company will be exhibiting at the "12th Annual Meeting of the Japanese Society for Extracellular Vesicles" to be held at the Senri Life Science Center. We will be showcasing various products during the event. We invite all relevant parties to come and visit us. 【Suppliers】 - Partical Metrix - Dynamic Biosensors

[Speaker] Director of Komatsu Engineering Office, Master of Manufacturing, Mr. Michio Komatsu [Lecture Topics] 1. K2025 Main Theme "The Power of Plastics! Green- Smart- Responsible" 2. The Strength of Europe's Plastic Circular Economy 3. Directions for "Chemical Recycling" and "Mechanical Recycling" 4. Utilization of Renewable Energy 5. Quality Evaluation Technology for Significantly Evolved Recycled Materials 6. Latest Information on EV-related Parts, Super Engineering Plastics for Batteries, and Silicone Resins 7. The Situation Surrounding Bioplastics 8. Rapid Growth in Demand for Electric Injection Molding Machines 9. Evolution of Valve Gate Technology 10. Q&A / Business Card Exchange *The content of the lecture may change based on local survey results and international circumstances.