[December 13, 2023 - December 15, 2023] Yamashita Material Announcement of Participation in SEMICON Japan 2023 Special Exhibition "7th FLEX Japan 2023"

"FPC Manufacturing Case Studies" now available! Single-sided FPC production starts from 1 day and double-sided FPC production from 2 days, with production available from 1 piece. We also support pattern design and component assembly.

At Yamashita Material Co., Ltd., we offer a short delivery manufacturing service for flexible printed circuit boards (FPC). We handle not only FPC production but also pattern design, component assembly, and component procurement. We cater to a wide range of needs, from prototype production for research and development purposes to small-lot mass production. 【Features】 We provide short delivery times for small-scale production of single-sided FPC, double-sided FPC, pattern design, and component assembly. 【Delivery Time Estimates】 Single-sided FPC: Shortest delivery time of 1 working day to standard delivery time of 15 working days Double-sided FPC: Shortest delivery time of 2 working days to standard delivery time of 20 working days FPC assembly: Additional 1 working day to the above delivery times. *Weekends, holidays, and designated company holidays are not counted in the delivery time. *Delivery times may vary depending on product specifications and quantities. *There are restrictions on the number of components for assembly. The standard specification is for 30 or fewer components for single-sided assembly and 30 or fewer boards.

• Printed Circuit Board

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

• Harness

Flexible substrate that bends freely and supports high current! Easily connects in tight spaces! Big Elec SMT Connect.

Attention all users of electric wires, wire harnesses, busbars, and bus bars! "Big Elec SMT Connect" (High Current FPC Surface Mount Connector Split Specification) is a compact flexible circuit board that allows for high current wiring even in extremely small spaces, thanks to its flat shape. It can be offered as a solution that significantly enhances design flexibility. The highly flexible circuit board allows for component mounting and can be used in bent configurations, making installation in tight spaces easy. Furthermore, its thinness contributes to space-saving. We propose an excellent high current wiring solution. Please give Big Elec SMT Connect a try!

• power supply
• Other power sources

Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.

The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.

• Wiring materials

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer

• Wiring materials

It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials

Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!

The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.

• Board to FPC connector

The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.

Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.

• High frequency/microwave parts
• Printed Circuit Board
• Wiring materials

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

In recent years, the implementation of maintenance DX to achieve "non-stop factories" has become an urgent necessity in manufacturing sites. Amid the trend of factory IoT and data utilization, the use of remote I/O, which can remotely aggregate and collect sensor information and control signals from equipment and sensors dispersed inside and outside the factory, is gaining importance as a foundation for predictive maintenance and condition monitoring. On the other hand, the installation environment for remote I/O is not necessarily limited to control panels or well-conditioned factory interiors. There is an increasing need to collect data in harsh environments, such as outdoor equipment and conditions involving high temperatures, low temperatures, vibrations, and strong electrical noise. Conventional remote I/O systems have struggled to operate stably under such conditions, requiring measures like installation location constraints and additional protective enclosures. Environmentally robust remote I/O with wide temperature support and noise resistance can address these challenges, enabling the expansion of the scope of factory IoT and predictive maintenance to outdoor and remote equipment. In this seminar, we will introduce the lineup of Contec's environmentally robust remote I/O, the "CONPROSYS(R) Robust I/O Series," which includes a total of 23 products.

[Speaker] Miyamoto Mariko, Senior Researcher, Public Policy Research Department, SOMPO Institute Plus Inc. [Lecture Items] 1. Overview and Latest Trends of Green Infrastructure (1) Background of Growing Attention and Market Expansion Outlook (2) Current Situation and Challenges for Promotion 2. Economic Effects of Green Infrastructure (1) Domestic Examples (Parks, Road Facilities, etc.) (2) International Examples 3. Evaluation and Certification Systems (1) Systems Related to Buildings (2) Systems Related to Sites and Urban Spaces 4. Financing Methods for Green Infrastructure (1) PPP/PFI (2) Sustainable Finance 5. Q&A / Business Card Exchange

[Lecturers] Nishimura & Asahi Law Offices, Foreign Law Joint Enterprise Attorney and Associate Iku Akamatsu Attorney and Associate Yasukazu Yamazaki (Note: "Saki" is a variant character) [Key Lecture Content] In the logistics sector and other areas, discussions are underway regarding the social implementation of drone flight routes. Drone flight routes involve various stakeholders, including drone route operators, drone operation businesses, surrounding municipalities, and ground-related parties, who collaborate and divide roles to realize these routes. Therefore, drone route operators and businesses utilizing drone routes need to enter into contracts regarding the use of drone routes with relevant parties, clarify roles, and implement appropriate risk management. This lecture will explain the legal points that must be considered when entering into contracts for the use of drone flight routes. [Lecture Items] 1. Overview of drone flight routes and recent examination status 2. Stakeholders and their roles related to drone flight routes 3. Items to consider specifying in contracts for the use of drone flight routes 4. Legal points to be aware of in contracts for the use of drone flight routes 5. Q&A / Business card exchange

[Speaker] Keiichi Koga, Senior Development Manager, Innovation Strategy Center, Japan Research Institute, Ltd. [Key Lecture Content] After the transition to the Trump administration, significant changes have emerged in the global business environment concerning the oceans, particularly regarding decarbonization and nature conservation. On the other hand, considering the accumulation of knowledge and shared understanding of the realities of the marine environment, what growth strategies should companies outline? In the financial sector, which is focusing on the expansion of the blue economy, there is a growing recognition that advancing nature-positive businesses can lead to sustainable corporate value enhancement. The sectors related to the ocean encompass not only fisheries and shipping but also a wide range of areas such as water pollution, plastic waste, tourism, and energy-related industries. This lecture will discuss the seeds for considering how businesses can transform. [Lecture Items] 1. The Blue Economy so far 2. International Trends 3. Financing Trends related to the Blue Economy 4. Directions for Business Transformation based on the Blue Economy 5. Case Studies 6. Q&A / Business Card Exchange