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  6. Low-rebound, high-speed transmission flexible substrate

Low-rebound, high-speed transmission flexible substrate

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last updated:Oct 14, 2024

山下マテリアル
山下マテリアル
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Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.

The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.

    Wiring materials
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Low-rebound, high-speed transmission flexible substrate

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  • Related Link - https://www.yamashita-net.co.jp/lp/lowhighfpc/
  • Special site - Product/service details - https://pr.mono.ipros.com/yamashita-net/product/

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basic information

【Layer Structure】 ■Insulator ■Conductor GND Layer ■Adhesive ■Insulator (Polyimide) ■Adhesive ■Conductor RF Line ■Insulator (Polyimide) ■Adhesive ■Conductor GND Layer ■Insulator *For more details, please refer to the PDF document or feel free to contact us.

Price range

P3

Delivery Time

P4

※The delivery time and price may vary depending on the quantity, so please feel free to contact us.

Applications/Examples of results

Low-rebound, high-speed transmission FPC can be applied to various uses by leveraging its high-speed transmission performance and low-rebound characteristics. ■ Servers and Data Centers ■ Medical Devices ■ High-Performance Computers, CPU Boards ■ Industrial Equipment ■ Security and Surveillance Systems *For more details, please refer to the PDF document or feel free to contact us.

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Low rebound, high-speed transmission FPC

Low rebound, high-speed transmission FPC

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Notice of Yamashita Material's participation in KIMES 2025 (Booth Number: D730) from March 20 to March 23, 2025.

  • Seminar・Event

At the "KIMES2025" exhibition booth of Daitron Korea Co., Ltd., we will be showcasing Yamashita Material Co., Ltd.'s SAP-FPC, All-LCP, long FPC, and more. This exhibition is one of the largest medical device and healthcare technology exhibitions in Korea. Dates: March 20 to March 23, 2025 Venue: COEX (Seoul, Korea) Exhibition Booth: D730 (within the Daitron Korea booth) In addition to the above, we plan to display various other samples, so please come and experience them at the venue. We sincerely look forward to your visit. For more details about the exhibition, please refer to the following URL: https://www.kimes.kr/eng/exhibitor/detail/2148798972_2025_kor

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[December 13, 2023 - December 15, 2023] Yamashita Material Announcement of Participation in SEMICON Japan 2023 Special Exhibition "7th FLEX Japan 2023"

  • Seminar・Event

We would like to inform you that we will be exhibiting at the special exhibition "7th FLEX Japan 2023" at SEMICON Japan 2023 from December 13 (Wednesday) to December 15 (Friday). FLEX Japan is the only international exhibition in Japan specializing in FHE (Flexible Hybrid Electronics). It will showcase a variety of the latest thin, lightweight, and bendable flexible electronics, as well as hybrid technologies combining rigid silicon semiconductors. Flexible devices can only be fully appreciated through seeing and touching them, which fosters discussion. We would be grateful if you could stop by the Yamashita Material booth during your visit. [Main Exhibits] - Long-term high-temperature durable FPC - Low-loss FPC - Big Elec (high-current FPC) We understand this is a busy time, but we sincerely look forward to your visit.

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Notice of Participation in MWE 2023 (Microwave Workshops and Exhibition) by Yamashita Material from November 29 to December 1, 2023.

  • Seminar・Event

We will be exhibiting at MWE 2023 (Microwave Workshops and Exhibition) held from November 29 to December 1, 2023. On that day, we will showcase flexible printed circuits (FPC) focusing on low-loss FPC and high-current FPC "BigElec." We invite you to take this opportunity to see our products and experience our innovative technology. Advance registration is required for entry. Please register using the following URL: https://f-vr.jp/mw/jizen23/

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山下マテリアル

山下マテリアル

Electronic Components and Semiconductors

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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.

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