Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.
The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Layer Structure】 ■Insulator ■Conductor GND Layer ■Adhesive ■Insulator (Polyimide) ■Adhesive ■Conductor RF Line ■Insulator (Polyimide) ■Adhesive ■Conductor GND Layer ■Insulator *For more details, please refer to the PDF document or feel free to contact us.
Price range
P3
Delivery Time
P4
※The delivery time and price may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
Low-rebound, high-speed transmission FPC can be applied to various uses by leveraging its high-speed transmission performance and low-rebound characteristics. ■ Servers and Data Centers ■ Medical Devices ■ High-Performance Computers, CPU Boards ■ Industrial Equipment ■ Security and Surveillance Systems *For more details, please refer to the PDF document or feel free to contact us.
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Company information
We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.
![[Research Material] Global Market for Flexible Printed Circuit Boards](https://image.mono.ipros.com/public/product/image/1f2/2001470451/IPROS16049092355565294284.jpeg?w=280&h=280)
