Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)
It is a flexible substrate that combines heat resistance and transparency. FPC
Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.
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basic information
Compared to glass materials, it is possible to design unique shapes not only in flat surfaces but also in curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a transparent conductive substrate for touch panels, a substrate for organic EL and LED lighting, and as an alternative to glass substrates for mobile phone displays. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding and encapsulated with resin. The light will pass through the transparent polyimide and beautifully illuminate the opposite side. Flexible substrates, FPC, flexible boards, rigid-flex, high heat resistance, membrane switches, flexible substrates, FPC, printed circuit boards, flexible substrates, FPC, Hamamatsu City, substrate design, substrates, printed circuit boards, pattern design, assembly, SMD assembly, substrate analysis, circuit design, software, hardware, electronic circuit design, rigid-flex, heat dissipation substrates, special substrates, stretchable substrates, transparent polyimide, polyimide, MEMS, semiconductors, special materials, plating technology, wearables.
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Applications/Examples of results
Automotive equipment, industrial equipment, medical devices, wearable devices, amusement, semiconductors, home appliances and AV equipment, optical devices, audio and video equipment, office automation equipment, information and communication equipment, machine tools, etc. FPC
Company information
Sartec is a manufacturing support company based in Hamamatsu City, Shizuoka Prefecture, focused on flexible circuit board design. Going beyond our core strength and origin in "flexible circuit board design," we provide support tailored to each stage of development, from initial development to mass production, including software/hardware development, enclosure design, prototype evaluation, and manufacturing support. Printed circuit boards are an essential component often referred to as the "heart" of a product. Because we have a deep understanding of this core part, we can create a development process with minimal setbacks through our approach of "manufacturing that considers the user's experience" combined with "process design capabilities that encompass the entire product," turning the ideals of researchers and developers into tangible reality. At Sartec, we have a wide range of achievements across various fields, from cutting-edge special designs in medical and aerospace sectors to everyday products like automobiles and IoT appliances. We are also flexibly responding to the semiconductor field, which has been gaining attention in recent years, expanding the possibilities of technology through processes like film formation. If you have a desire to challenge conventional industry norms and pursue products or new technologies that do not yet exist in the world, please feel free to consult with Sartec.