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  6. 【Substrate Analysis Service】FPC・Flexible Substrate

【Substrate Analysis Service】FPC・Flexible Substrate

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last updated:Jun 20, 2023

サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計
サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計
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We will support and propose ideas to enhance development capabilities, working closely with the development technology personnel! FPC

- Circuit investigation - Component investigation (creating parts list, investigating constants and sizes, collecting catalogs) - Design specification investigation (minimum hole diameter, minimum L/S investigation) - Substrate destruction investigation (layer composition, plating thickness, inner layer pattern arrangement) - Substrate non-destructive investigation (X-ray transmission, CT images) - Assembly analysis investigation (solder composition, wettability, bonding strength, etc.) - Quality investigation (thermal shock testing, temperature and humidity cycles, etc.) FPC

    Circuit board design and manufacturingContract manufacturingContract Analysis
平面研磨.jpg

【Substrate Analysis Service】FPC・Flexible Substrate

平面研磨.jpg
平面研磨.jpg

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- I want to accumulate issues to shorten the development period. - I want to hear negative opinions from third parties unrelated to the OEM vendor. - I want to review because the parts have been discontinued, but there is no remaining data. - I want to know the industry’s circuit board technology level. FPC As such, the purposes of circuit board analysis vary depending on the customer. Our company will conduct circuit board analysis from a field perspective and support the improvement of development capabilities. FPC Flexible circuit boards, flex boards, FPC, flex, rigid-flex High heat resistance, membrane switches, flexible circuit boards, flex, FPC, printed circuit boards Benchmarking, reverse engineering, analysis, circuit extraction Flexible circuit boards, flex boards, FPC, flex, Hamamatsu City, Circuit board design, circuit boards, printed circuit boards, pattern design, assembly, SMD assembly, circuit board analysis, circuit design, software, hardware, Electronic circuit design, rigid-flex, heat dissipation boards, Specialty boards, stretchable boards, transparent polyimide, polyimide MEMS, semiconductors, special materials, plating technology, wearable FPC

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In-vehicle devices, industrial equipment, medical devices, wearable terminals, amusement, semiconductors, home appliances and AV equipment, optical devices, audio and video equipment, office automation equipment, information and communication devices, machine tools, etc. FPC.

Company information

サーテック

サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計

Electronic Components and Semiconductors

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Sartec is a manufacturing support company based in Hamamatsu City, Shizuoka Prefecture, focused on flexible circuit board design. Going beyond our core strength and origin in "flexible circuit board design," we provide support tailored to each stage of development, from initial development to mass production, including software/hardware development, enclosure design, prototype evaluation, and manufacturing support. Printed circuit boards are an essential component often referred to as the "heart" of a product. Because we have a deep understanding of this core part, we can create a development process with minimal setbacks through our approach of "manufacturing that considers the user's experience" combined with "process design capabilities that encompass the entire product," turning the ideals of researchers and developers into tangible reality. At Sartec, we have a wide range of achievements across various fields, from cutting-edge special designs in medical and aerospace sectors to everyday products like automobiles and IoT appliances. We are also flexibly responding to the semiconductor field, which has been gaining attention in recent years, expanding the possibilities of technology through processes like film formation. If you have a desire to challenge conventional industry norms and pursue products or new technologies that do not yet exist in the world, please feel free to consult with Sartec.

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