A comprehensive reveal of plating chemicals and plating processes for semiconductors!

TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.

Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.

• Chemicals

Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

• Chemicals

Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.

• Chemicals

FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.

In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.

• Chemicals

It is the process of forming UBM. It can improve the connection reliability between the aluminum electrode and the package terminal.

UBM stands for Under Bump Metal or Under Barrier Metal, and it is a film formed to join aluminum electrode pads on semiconductor chips with package terminals through wire bonding, soldering, or silver sintering. This film is composed of materials such as electroless nickel/gold plating or electroless nickel/palladium/gold plating. We offer a wide range of products that support the evolution of semiconductors and electronics, so please feel free to consult with us.

• Chemicals

Regarding the "quotation" used at the forefront of sales activities: "Do we really need to save everything when we revise it to Ver.1, Ver.2, etc., every time the amount or specifications change?" "Should we also keep the data from other companies that were not selected in competitive quotations?" Have you ever wondered about these questions? The Electronic Bookkeeping Act strictly demands the "authenticity" of data, but saving every process is a significant burden for the field. This time, we will clearly explain the boundaries of the preservation obligation in a case study format, incorporating the latest interpretations from the National Tax Agency's Q&A. *You can read the full text from the note in the "Related Links." [Contents of this article] 1. The boundary of the preservation obligation lies in "sending to external parties." - Items sent externally are "generally required to be preserved." - Items not sent externally have "no preservation obligation." 2. The sender's judgment: "Is it linked to a transaction?" 3. The recipient's judgment: "The perspective of the 'Corporate Tax Act' is important." ■ Note! "Version revisions" and "corrections/deletions" are different things. ■ A smart way to achieve reliable "version management." ■ Summary

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

Fukuda's new flagship model. - Masterless type (FLA-0200 series) - General type (FLA-0201 series) Two models of air leak testers. With the mastering correction function, high-precision measurements can be achieved in a short time. Please take a look at the catalog.

What is a sealed product air leak test device? It is an air leak test device that inspects the airtightness, sealing performance, and waterproofness of electrical equipment and packaging containers (cosmetics, food). It tests for leaks in products such as smartphones, tablet devices, keyless switches, wristwatches, bottle containers, and cosmetic containers (eyeliner, mascara).

【Leak testers and leak test-related products provided by Fukuda】 Please take a look at our catalog! ★ Millimeter-wave radar & LiDAR leak tester: The air leak tester "FL-610" for controlling the separate type leak tester air pressure unit "LPU-300." ★ Leak tester for simultaneous measurement of workpieces: Measures two workpieces with one unit. By comparing two at the same time, you can increase the number of operations. ★ Electric air regulator for blood pressure monitor pressure confirmation: Excellent in repeatability of pressure control and pressure adjustment. ★ Leak tester for automotive lighting: Can be tested at low pressure without affecting the workpiece (item under inspection). ★ Air leak tester conversion box/cable: Peripheral equipment for air leak testers. Used when replacing old models with current products or when changing the model of current products. ★ Waterproof inspection testing device: A device for testing the waterproofness (equivalent to IPX7,8) and sealing of sealed products. It can be used for various products such as electronic devices and packaging containers.