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  6. Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

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last updated:Dec 12, 2023

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

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TORYZA

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

TORYZA LCN SV製品情報.jpeg
TORYZA LCN SV製品情報.jpeg
  • Related Link - https://www.okuno.co.jp/product/feature/toryza_lcn…

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We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home appliances, and various electronics, so please feel free to contact us.

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Semiconductor package substrate

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

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We will exhibit at the 1st [Kyushu] Semiconductor Industry Exhibition.

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Our company will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition, which will be held at Marine Messe Fukuoka Hall B from September 25 (Wednesday) to 26 (Thursday), 2024. At our booth, we will showcase the latest surface treatment chemicals and process technologies for wafers and package substrates, so please stop by. For more details, please check the related link [We will be exhibiting at the 1st [Kyushu] Semiconductor Industry Exhibition].

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We will be exhibiting at the 53rd International Electronic Circuit Industry Exhibition, JPCA Show 2024.

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Okuno Pharmaceutical Industry has newly developed surface treatment chemicals and process technologies that contribute to the high performance and multifunctionality of printed circuit boards and semiconductor package substrates. The new products will be introduced at the 53rd International Electronic Circuit Industry Exhibition, JPCA Show 2024, which will be held from June 12 (Wednesday) to June 14 (Friday) at Tokyo Big Sight. At the venue, we will showcase the latest surface treatment chemicals and process technologies for wafers, package substrates, printed wiring boards, FPCs, and power modules. Additionally, we will present new technologies such as high-reliability granular copper plating with excellent adhesion to encapsulation resins, lithium dendrite growth suppressants, and plating technologies using recycled materials, so please stop by. For more details, please check the related link [We will be exhibiting at the 53rd International Electronic Circuit Industry Exhibition, JPCA Show 2024].

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We will be exhibiting at the Semiconductor and Sensor Packaging Exhibition / the Specialized Exhibition for Semiconductor Backend Processes (ISP).

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Okuno Pharmaceutical Industry has developed new surface treatment chemicals and plating processes for semiconductors to respond to the evolution of semiconductors. The new products will be introduced at the 25th Semiconductor and Sensor Packaging Exhibition, which will be held at Tokyo Big Sight from January 24 (Wednesday) to January 26 (Friday), 2024. At the venue, we will present plating chemicals and processes for semiconductor wafers and package substrates, ultra-fine wiring, and the latest surface treatments for power devices, under the theme of OKUNO contributing to the development of printed circuit boards and semiconductor package substrates. We will also showcase the new "TORYZA" series for semiconductor back-end processes, including an electroless plating process for UBM formation on wafers and dedicated plating equipment, so please stop by. For more details, please check the related link [Exhibiting at the Semiconductor and Sensor Packaging Exhibition/Specialized Exhibition for Semiconductor Back-End Processes (ISP)].

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A comprehensive reveal of plating chemicals and plating processes for semiconductors!

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Semiconductor devices, interposers that relay between semiconductor devices and printed circuit boards, and the wiring of packages used for directly mounting semiconductor chips onto printed circuit boards utilize plating technology for purposes such as transmitting electrical signals, sharing power, and heat dissipation. Okuno Pharmaceutical Industry has newly developed surface treatment chemicals and plating processes for semiconductors to keep up with the evolution of semiconductors. ◆ UBM formation for aluminum electrodes on wafers Plating process and dedicated plating equipment TORYZA EL PROCESS, TORYZA EL SYSTEM ◆ For semiconductor wafers Newly developed copper sulfate plating chemicals TORYZA LCN series For more details, please contact us.

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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