We will exhibit at the 1st [Kyushu] Semiconductor Industry Exhibition.

Newly developed copper sulfate plating chemicals for wiring of semiconductor wafers.

As the functionality, performance, and miniaturization of semiconductors continue to evolve, new technologies related to three-dimensional integration of semiconductors are being developed one after another. Consequently, addressing the miniaturization of wiring (narrow pitch) and heat dissipation measures has become increasingly important. To meet various demands, our company has newly developed sulfuric acid copper plating chemicals, the TORYZA LCN series, for semiconductor wafer wiring.

• Chemicals

TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.

Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.

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Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

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Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.

• Chemicals

FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.

In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.

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Plating chemicals, total proposals for surface treatment processes and equipment, aluminum electrodes on wafers, UBM formation, plating process.

UBM (Under Barrier Metal) employs processes such as electroless Ni/Au plating and electroless Ni/Pd/Au plating. However, conventional processes have faced challenges such as localized corrosion of aluminum electrodes, poor appearance of plating, and poor adhesion. Additionally, in recent years, as power semiconductors have progressed towards higher voltage and higher current, there has been a demand for further heat resistance in electroless plating films. In response, we have developed a new UBM formation plating process called "TORYZA EL PROCESS," which suppresses film reduction and localized corrosion of aluminum electrodes while providing excellent uniform deposition, smoothness, and adhesion of electroless Ni plating. Along with the electroless plating equipment for UBM formation, "TORYZA EL SYSTEM," we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

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Plating chemicals, total proposals for surface treatment processes and equipment, electroless plating equipment for UBM formation for wafers.

Leveraging the know-how acquired as a surface treatment and plating chemicals manufacturer, we designed and developed the electroless plating system "TORYZA EL SYSTEM" for UBM formation in collaboration with equipment manufacturers. Along with the plating process "TORYZA EL PROCESS" for UBM formation on aluminum electrodes on wafers, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

• Chemicals

Achieving thin film deposition of non-electrolytic copper plating! It greatly contributes to the formation of fine circuits on semiconductor package substrates and the improvement of via connection reliability!

In recent years, with the miniaturization and high performance of electronic devices, semiconductor devices have also become more refined and functional. There is a growing demand for further miniaturization of wiring and reduction of via diameters in semiconductor package substrates that connect semiconductor devices to the main substrate. Okuno Pharmaceutical Industry has newly developed products to meet the demands for fine wiring. Highest via connection reliability: Electroless copper plating solution: OPC FLET Copper - Achieves crystal continuity at the bottom of the via - Conventional baths see a significant increase in resistance due to a decrease in the thickness of the electroless copper plating film OPC FLET Copper shows good conductivity even at low film thickness - Controls the plating deposition rate - The deposition rate becomes gradual over time, suppressing deposition on copper - Conventional baths tend to have excessive surface film thickness OPC FLET Copper achieves sufficient coverage at low film thickness - Excellent connection reliability for small-diameter vias

• Chemicals

TOYOROBO Co., Ltd. has signed a general agency agreement with OUNITECH ROBOTICS, a robotics company engaged in the development and manufacturing of AI-powered cleaning robots, effective July 4, 2025. Prior to the domestic launch of 'RoboSweep' in Japan, we have initiated a proof of concept (PoC) at our office location in the complex facility "the SOHO," aimed at verifying and optimizing product performance suitable for the Japanese market. 'RoboSweep' is a robot developed to achieve safe and efficient cleaning operations in various environments such as commercial facilities, office buildings, healthcare and welfare, and sports complexes, equipped with advanced autonomous driving technology and AI algorithms. In this proof of concept (PoC), we will measure and evaluate the effectiveness of obstacle avoidance capabilities, cleaning quality, and operational efficiency within actual facilities, aiming for further optimization of product performance, including the Japanese facility environment and detailed operational capabilities.

The size of the Japanese soup market reached 700 million USD in 2024. Going forward, the IMARC Group predicts that the market will reach 900 million USD by 2033, showing a growth rate (CAGR) of 2.9% between 2025 and 2033. The Japanese soup market is experiencing stable growth, supported by consumer needs for convenience, instant preparation, and health consciousness. Innovations in taste, packaging, and functional ingredients continue to attract a diverse customer base. This report analyzes key trends in each market segment and provides country-level forecasts from 2025 to 2033. The report is categorized by type, category, packaging, distribution channel, region, and MIMO composition. This report focuses on market structure, positioning of key players, strategies, competitive dashboards, and corporate evaluation quadrants, providing a detailed analysis of the competitive landscape. And email: sales@imarcgroup.com

The Japanese LED display market reached 473.13 million USD in 2024. The IMARC Group forecasts that this market will grow at a compound annual growth rate (CAGR) of 11.88% between 2025 and 2033, reaching 1.29942 billion USD by 2033. The Japanese LED display market is steadily growing, supported by increased adoption in advertising, sports, transportation, and entertainment sectors. Advances in technology have improved display quality, energy efficiency, and versatility for a wide range of applications. This report analyzes key trends in each market segment and provides country-level forecasts from 2025 to 2033. The report is segmented based on technology insights, color insights, application insights, end-user insights, regional insights, and MIMO configuration insights. This report focuses on market structure, positioning of key players, strategies, competitive dashboards, and corporate evaluation quadrants, providing a detailed analysis of the competitive landscape. And email: sales@imarcgroup.com

The Japanese biosimilar market reached 475.8 million USD in 2024. Going forward, the IMARC Group predicts that the market size will reach 3.4196 billion USD by 2033, growing at an average annual growth rate of 22.7% from 2025 to 2033. The expansion of the Japanese biosimilar market is driven by the increasing demand for cost-effective biological products and the development of a regulatory framework to support it. The rising adoption of biosimilars in the treatment of oncology, autoimmune diseases, and chronic conditions is propelling market growth. This report analyzes key trends in each market segment and provides country-level forecasts from 2025 to 2033. The report is segmented based on insights into molecules, indications, and manufacturing types. It focuses on market structure, positioning of key players, strategies, competitive dashboards, and corporate evaluation quadrants, providing a detailed analysis of the competitive landscape. Email: sales@imarcgroup.com

Thank you very much for your continued support. We would like to inform you that our company will be closed for summer vacation on the following dates. ■ Summer Vacation Period From Wednesday, August 13, 2025, to Sunday, August 17, 2025. We will resume normal business hours on Monday, August 18, at 8:30 AM. We apologize for any inconvenience this may cause and appreciate your understanding.