We will be exhibiting at the 53rd International Electronic Circuit Industry Exhibition, JPCA Show 2024.

TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.

Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.

• Chemicals

Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

• Chemicals

Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.

• Chemicals

FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.

In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.

• Chemicals

It is the process of forming UBM. It can improve the connection reliability between the aluminum electrode and the package terminal.

UBM stands for Under Bump Metal or Under Barrier Metal, and it is a film formed to join aluminum electrode pads on semiconductor chips with package terminals through wire bonding, soldering, or silver sintering. This film is composed of materials such as electroless nickel/gold plating or electroless nickel/palladium/gold plating. We offer a wide range of products that support the evolution of semiconductors and electronics, so please feel free to consult with us.

• Chemicals

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

The date for the "Tokai Area Electrical and Electronic WEB Technology Seminar" for the 2026 fiscal year has been decided. Registration has started, so if you are interested, please apply. Multiple participants from one company are allowed, so please make use of this opportunity to acquire basic knowledge. 【April】Basic Knowledge of Resistors 【May】Technical Course on Capacitors 【June】Basics of Motors and How to Choose the Optimal Driver 【July】Fundamentals of IC Socket and Connector Selection 【September】Basics of Magnets 【October】Failure Phenomena of Chip Resistors and Their Countermeasures 【November】Temperature Protection Design Using Thermal Fuses

NDT Mart & Rental Co., Ltd. began selling its new electromagnetic ultrasonic thickness gauge, 'EMAT WIFI', on January 19, 2026. ◆ Electromagnetic Ultrasonic Thickness Gauge 'EMAT WIFI' The 'EMAT WIFI' is a thickness gauge that uses the electromagnetic ultrasonic (EMAT) method, which does not require a couplant (contact medium). Unlike conventional ultrasonic thickness gauges (UT), there is no need to apply a couplant; thickness measurements can be taken simply by placing the probe on the measurement target, making it ideal for beginners and screening in large-scale sites. It can measure materials with paint, scale, thick linings, and slight surface roughness, significantly reducing the hassle of pre-treatment. Additionally, it is equipped with WiFi communication capabilities, allowing for the confirmation and management of measurement data and waveforms in conjunction with smartphones and tablets. This facilitates smooth sharing of measurement results and data management on-site. It is optimal for measuring wall thickness and conducting corrosion inspections of plant equipment, piping, tanks, and steel structures. It contributes to the efficiency and reliability of thickness measurements in the field of non-destructive testing (NDT), such as maintenance inspections and equipment diagnostics.