We will be exhibiting at the Technical Show Yokohama 2024 [E Plan Co., Ltd.].

On this occasion, we have opened a showroom for Tajima embroidery machines in conjunction with the renovation of the Chūnichi Jūki headquarters building. To commemorate the opening of the showroom, we will hold an exhibition of Tajima embroidery machines.

Copper, which has a high laser reflectivity and quickly dissipates the thermal energy from laser irradiation, was difficult to shape using metal 3D printers. However, recently developed high-performance and high-functionality metal 3D printers, along with pure copper and copper alloy powders that have a high laser absorption rate and excellent 3D moldability, have been introduced to the market, and practical applications are rapidly advancing in leading companies. Metal 3D printers enable the creation of complex shapes and integrated structures, lattice/porous structures, and hybrid structures that were previously impossible, allowing for the innovation of parts, rapid development and prototyping of components, significant reduction in the number of parts, improved quality, lightweight and compact designs, and cost reduction. This has led to increased adoption and utilization in applications such as heating coils, heat sinks, heat exchangers, motor coils, and electronic and electrical devices. In this seminar, we will provide a clear and detailed explanation of the latest trends in pure copper and copper alloy powders suitable for 3D additive manufacturing, developed by Fukuda Metal Foil Powder Industry, as well as case studies of layered molding with pure copper and copper alloys. We will also discuss innovative molding technologies and examples that are unique to our company, as demonstrated by leading users such as TK Engineering, ODEC, and Fasotec, who are utilizing metal 3D printers to manufacture low-cost, high-quality copper components in a short time, sharing both success and failure stories.

We will hold an in-person event to introduce the latest technologies in molecular design. In addition to updates on the molecular design platform "Orion," we are scheduled to have cutting-edge research presentations by OpenEye and external speakers, including "the discovery of new leads by adding three-dimensionality to trillion-scale virtual screening" and "the identification of cryptic pockets that expand druggable areas." Furthermore, we will be introducing the next-generation shape similarity search tool "ROCS X," which was first unveiled at miniCUP Boston, for the first time in Japan at this event. ROCS X evolves the traditional ROCS, enabling faster and more accurate three-dimensional screening, contributing to the efficiency of lead discovery in drug research. Don't miss the latest technologies that accelerate the drug discovery process, including molecular modeling, structure-based drug design, and AI-driven screening! We look forward to your participation.

We will hold an in-person event to introduce the latest technologies in molecular design. In addition to updates on the molecular design platform "Orion," we plan to feature cutting-edge research presentations by OpenEye and external speakers, including "New lead discovery by adding three-dimensionality to trillion-scale virtual screening" and "Identification of cryptic pockets to expand druggable space." Furthermore, we will be introducing the next-generation shape similarity search tool "ROCS X AI," which was first unveiled at miniCUP Boston, for the first time in Japan at this event. ROCS X AI evolves the traditional ROCS, enabling faster and more accurate three-dimensional screening, contributing to the efficiency of lead discovery in drug research. Don't miss out on the latest technologies that accelerate the drug discovery process, including molecular modeling, structure-based drug design, and AI-driven screening! We look forward to your participation.

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505